TFM-127-01-LM-D-A-P-TR SAMTEC Connector (Other) In Stock

Name: TFM-127-01-LM-D-A-P-TR
Brand: SAMTEC
SKU: TFM-127-01-LM-D-A-P-TR
Availability: InStock

SAMTEC TFM-127-01-LM-D-A-P-TR is a Tiger Eye dual-row terminal strip with 0.050-inch pitch and 54 positions in a low-profile surface-mount configuration with polarization and tape-and-reel packaging. Optimized for high-density mezzanine board-to-board interfaces requiring fine-pitch reliability. Available from SAMTEC with worldwide shipping.

ACTIVEConnectorVerified Jun 2026

Package / Visual Reference

TFM-127-01-LM-D-A-P-TROther

Quick Facts

Manufacturer: SAMTEC
Package: Other
Pin Count: 54
Lifecycle: ACTIVE
Datasheet: TFM-127-01-LM-D-A-P-TR Datasheet PDF
Category: Connector
RoHS: Compliant
Lead Time: 3–7 business days
Shipping: DHL Express · Worldwide

What are the key features of TFM-127-01-LM-D-A-P-TR?

0.050-inch (1.27 mm) dual-row pitch enables 54 contacts in a compact low-profile SMT footprint
Polarized housing prevents 180-degree mis-mating, protecting downstream circuitry in high-volume production environments
Tape-and-reel (TR) packaging supports automated SMT pick-and-place assembly at high throughput rates

What is TFM-127-01-LM-D-A-P-TR used for?

The TFM-127-01-LM-D-A-P-TR is used in compact mezzanine board stacking designs within embedded computing, FPGA carrier boards, and wireless communication modules requiring 54-signal interconnects in a minimal profile. Its low-profile LM mating height keeps board-to-board stack separation as small as practical for dense multi-board enclosures, reducing overall system height. Tape-and-reel delivery and SMT compatibility streamline automated assembly for high-volume production of IoT gateways, industrial controllers, and portable instruments.

Compliance & Regulatory

RoHS Status	Compliant
Lead-Free	Yes (Pb-Free)

Where can I find the TFM-127-01-LM-D-A-P-TR datasheet?

TFM-127-01-LM-D-A-P-TR Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for TFM-127-01-LM-D-A-P-TR?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What does the LM designation in TFM-127-01-LM-D-A-P-TR specify about the connector's mating height?

The LM suffix in TFM-127-01-LM-D-A-P-TR identifies a low-profile mating height variant of the TFM Tiger Eye series, providing a board-to-board stack height typically between 4 mm and 6 mm versus standard-height variants at 8 mm or more. This reduced stack height is critical for multi-board systems inside enclosures with internal clearances under 15 mm, such as embedded computing modules and compact IoT gateway designs.

For an FPGA carrier board requiring 50 or more signals to a mezzanine module, how does TFM-127-01-LM-D-A-P-TR address density and alignment requirements?

TFM-127-01-LM-D-A-P-TR provides 54 positions at 0.050-inch (1.27 mm) pitch in a dual-row layout, accommodating 50 signal lines plus 4 ground returns in a connector body under 35 mm long. The polarization feature prevents the mezzanine FPGA module from seating backwards, protecting I/O bank voltages ranging from 1.2 V to 3.3 V from reverse-polarity supply connections that could permanently damage FPGA I/O buffers.

How does the tape-and-reel format of TFM-127-01-LM-D-A-P-TR benefit procurement for a run of 5000 FPGA modules per month?

Tape-and-reel packaging ships TFM-127-01-LM-D-A-P-TR on EIA-481 standard reels compatible with SMT feeders, enabling uninterrupted automated placement at machine speeds exceeding 5000 parts per hour. For 5000 modules per month, reel-based delivery reduces feeder replenishment stops and eliminates the connector orientation sorting that loose-piece bags require, cutting assembly line setup time by approximately 20 minutes per production batch.

In what scenarios is TFM-127-01-LM-D-A-P-TR preferred over a wire-to-board connector for linking a sensor module to a host PCB?

TFM-127-01-LM-D-A-P-TR is preferred when the sensor module physically mounts directly above the host PCB as a mezzanine card, eliminating discrete wiring harnesses entirely. Direct board-to-board mating supports signal frequencies above 100 MHz without the impedance discontinuities that ribbon cable introduces, and the 54-position interface matches the pin requirements of multi-channel ADC or sensor fusion SoCs without requiring secondary wiring work after SMT reflow.

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Lead Time3-7 business days

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TFM-127-01-LM-D-A-P-TR SAMTEC Connector (Other) In Stock

What are the key features of TFM-127-01-LM-D-A-P-TR?

What is TFM-127-01-LM-D-A-P-TR used for?

Compliance & Regulatory

Where can I find the TFM-127-01-LM-D-A-P-TR datasheet?

What are equivalent replacements for TFM-127-01-LM-D-A-P-TR?

Frequently Asked Questions

What does the LM designation in TFM-127-01-LM-D-A-P-TR specify about the connector's mating height?

For an FPGA carrier board requiring 50 or more signals to a mezzanine module, how does TFM-127-01-LM-D-A-P-TR address density and alignment requirements?

How does the tape-and-reel format of TFM-127-01-LM-D-A-P-TR benefit procurement for a run of 5000 FPGA modules per month?

In what scenarios is TFM-127-01-LM-D-A-P-TR preferred over a wire-to-board connector for linking a sensor module to a host PCB?

Related Guides

CSD87313DMS Synchronous Buck Power Stage Design Guide

STEF05SGR eFuse Selection Guide for 5 V Overcurrent Protection

C0402C103K3RACTU Selection Guide: Choosing a 10 nF 0402 MLCC

STM32H753VIT6 MCU Selection Guide: Memory, Package, Connectivity, and Security

Why Buy from FindMyChip

About SAMTEC

More from SAMTEC

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