TFM-127-01-L-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-127-01-L-D-A-P-TR is a high-reliability Tiger Eye terminal strip with 0.050" (1.27 mm) pitch and 54 positions in a low-profile dual-row SMT configuration. Features alignment post and polarization peg for precise automated assembly, supplied in tape-and-reel. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 54
- Lifecycle
- ACTIVE
- Datasheet
- TFM-127-01-L-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-127-01-L-D-A-P-TR?
- 54-position dual-row SMT terminal strip at 0.050" (1.27 mm) pitch enabling high-density signal interconnect in compact board-to-board applications
- Low-profile (L) variant minimizes connector height above PCB, supporting slim module designs in space-constrained embedded and telecom systems
- Integrated alignment post and polarization peg ensure correct mating orientation and prevent insertion errors during high-volume automated PCB assembly
What is TFM-127-01-L-D-A-P-TR used for?
The TFM-127-01-L-D-A-P-TR suits mezzanine card interconnect, FPGA daughter board attachment, and high-density signal routing in embedded computing and networking line cards where 54 channels must traverse a 1.27 mm pitch dual-row interface. The low-profile variant reduces overall stack height, enabling thinner server blade and switch module designs. Tape-and-reel packaging with polarization keying supports error-free high-volume SMT production in telecommunications infrastructure and defense avionics applications.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-127-01-L-D-A-P-TR datasheet?
TFM-127-01-L-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-127-01-L-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the low-profile (L) variant of TFM-127-01-L-D-A-P-TR reduce system stack height in mezzanine designs?
The low-profile L suffix designates a reduced-height SMT footprint compared to standard TFM-127 variants, lowering the above-board connector height by approximately 0.5 mm to 1 mm. This difference is critical in board stacking applications where total module thickness must fit within a 3U or 2U chassis slot, enabling designers to pack 54 signal channels across a 1.27 mm pitch interface without exceeding height budgets.
What production advantage does the tape-and-reel (TR) suffix provide for the TFM-127-01-L-D-A-P-TR in high-volume SMT lines?
Tape-and-reel packaging allows automated pick-and-place equipment to feed the TFM-127-01-L-D-A-P-TR continuously from reel carriers holding 500 or more units, eliminating manual tube-loading interruptions. Cycle times on high-speed lines assembling boards with 54-position connectors at 1.27 mm pitch drop significantly compared to bulk or tray-packed alternatives, improving output by hundreds of boards per shift.
When is TFM-127-01-L-D-A-P-TR a preferable alternative to a 0.100" pitch header for routing 54 signals between boards?
The TFM-127-01-L-D-A-P-TR becomes preferable when PCB area is constrained, because its 1.27 mm pitch packs 54 positions into roughly half the linear length required by a 0.100" (2.54 mm) pitch dual-row header carrying the same channel count. This halving of connector length frees several square centimeters of board space, which is especially valuable in high-density server blades, FPGA evaluation boards, and compact embedded controllers where multiple large connectors compete for routing area.
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