TFM-126-22-S-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-126-22-S-D-A-P-TR is a 52-position dual-row Tiger Eye terminal strip with 0.050-inch pitch and 22 mm stacking height, featuring polarized alignment in tape-and-reel format. It offers high-reliability contacts for surface mount mezzanine and board-to-board stacking interconnect applications. Available worldwide at competitive prices with global stock and fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 52
- Lifecycle
- ACTIVE
- Datasheet
- TFM-126-22-S-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-126-22-S-D-A-P-TR?
- 52 positions in a dual-row 0.050-inch (1.27 mm) pitch Tiger Eye terminal strip with 22 mm stacking height
- Polarized housing prevents incorrect 180° mating orientation in high-density board-to-board stacking applications
- Tape-and-reel (TR) packaging enables automated high-volume SMT pick-and-place and reflow assembly
- Tiger Eye contact technology provides reliable high-cycle mating with standard 0.050-inch pitch socket strips
What is TFM-126-22-S-D-A-P-TR used for?
The SAMTEC TFM-126-22-S-D-A-P-TR is ideal for 52-position dual-row mezzanine and board-to-board stacking interconnects in telecommunications, computing, and industrial embedded systems requiring 0.050-inch pitch with 22 mm stacking height. Its polarized alignment ensures correct mating with compatible socket strips in FPGA module, SoM, and backplane applications. The tape-and-reel format supports high-volume automated assembly for compact high-density PCB interconnect designs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-126-22-S-D-A-P-TR datasheet?
TFM-126-22-S-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-126-22-S-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and what stacking height does the TFM-126-22-S-D-A-P-TR provide for mezzanine connections?
The TFM-126-22-S-D-A-P-TR provides 52 positions in a dual-row configuration with a 22 mm stacking height and 0.050-inch pitch, supporting precise board-to-board separation in mezzanine and module stack designs.
What does the polarized (P) feature of the TFM-126-22-S-D-A-P-TR prevent during board stacking assembly?
The polarized alignment feature prevents incorrect 180° mating orientation across the 52-position dual-row interface, eliminating the risk of reversed insertion that could damage signal traces or the 0.050-inch pitch contacts during PCB stacking assembly.
In which FPGA module and SoM stacking designs does the TFM-126-22-S-D-A-P-TR provide the right 0.050-inch pitch fit?
The TFM-126-22-S-D-A-P-TR fits FPGA mezzanine cards, system-on-module carrier boards, and embedded computing stacks where 52-position dual-row connectivity at 0.050-inch pitch with 22 mm inter-board clearance is required, providing up to 2 A per contact current capacity for power and signal routing.
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