TFM-124-01-S-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-124-01-S-D-A-P-TR is a 24-position dual-row high-reliability Tiger Eye terminal strip with 0.050 inch pitch surface mount vertical design. Precision tin-over-nickel contacts and 1.27 mm centerline spacing deliver consistent electrical performance for dense board-to-board interconnects.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 48
- Lifecycle
- ACTIVE
- Datasheet
- TFM-124-01-S-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 24-position dual-row configuration at 0.050 inch (1.27 mm) pitch provides 48 pins in a compact SMT footprint for high-density signal routing
- Tiger Eye high-reliability contact technology ensures stable low-resistance mating across the product lifetime with repeatable insertion performance
- Tape-and-reel packaging enables seamless integration into automated SMT assembly lines using standard pick-and-place equipment at high-volume production rates
Applications
The TFM-124-01-S-D-A-P-TR is designed for high-density board-to-board stacking in embedded computing modules, network interface cards, and industrial control systems. Its 48-pin dual-row layout at 0.050 inch pitch serves multi-signal applications in data acquisition hardware and programmable logic controller daughter cards. Tape-and-reel delivery supports automated manufacturing in consumer electronics, telecommunications, and medical device platforms.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 24-position dual-row layout of TFM-124-01-S-D-A-P-TR affect the total pin count and PCB footprint?
The TFM-124-01-S-D-A-P-TR provides 48 pins total across 2 rows of 24 positions at 0.050 inch (1.27 mm) pitch. Compared to a single-row 48-pin connector at the same pitch, the dual-row arrangement halves the connector length, saving approximately 30 mm of PCB edge while preserving full signal capacity for dense interconnect designs.
Which board-stacking applications benefit most from the TFM-124-01-S-D-A-P-TR compared to larger pitch alternatives?
Applications requiring more than 40 signal lines in a PCB stack height under 5 mm benefit most from the TFM-124-01-S-D-A-P-TR. Examples include daughter-card memory modules, FPGA mezzanine cards, and sensor fusion boards in robotics platforms, where 0.050 inch pitch keeps the connector width below 35 mm even at 48 pins while meeting signal integrity targets.
What soldering process is compatible with TFM-124-01-S-D-A-P-TR, and what peak reflow temperature should be observed?
The TFM-124-01-S-D-A-P-TR is designed for standard SAC305 lead-free reflow soldering with a peak profile temperature of 260°C, consistent with IPC/JEDEC J-STD-020 classification. The tin-over-nickel contact finish wets reliably at standard reflow temperatures, and the SMT terminations are suited for double-sided reflow processes commonly used in high-volume PCB production for the 48-pin dual-row package.
How does TFM-124-01-S-D-A-P-TR compare to SAMTEC TFM-118 series for applications needing more signal channels?
The TFM-124-01-S-D-A-P-TR offers 48 pins versus 36 pins in the TFM-118 series, making it the better choice when a design requires 13 or more additional signal lines without increasing the connector pitch or mounting area proportionally. Both share the 0.050 inch pitch and Tiger Eye contact reliability, but the TFM-124 extends row length by 6 positions per row, adding approximately 7.6 mm to the connector body.
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