TFM-123-01-SM-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-123-01-SM-D-A-P-TR is a high-reliability Tiger Eye terminal strip with 0.050 inch (1.27 mm) pitch, dual-row, 23-position SMT design providing 46 gold-plated contacts for dense fine-pitch board-to-board signal routing. Tape-and-reel packaging supports high-volume automated assembly. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 46
- Lifecycle
- ACTIVE
- Datasheet
- TFM-123-01-SM-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-123-01-SM-D-A-P-TR?
- 23-position dual-row SMT at 0.050 inch (1.27 mm) pitch delivering 46 contacts in a compact approximately 29 mm row length
- Tiger Eye contact mechanism ensures high retention force and consistent contact resistance below 20 milliohms per pin
- Tape-and-reel (TR) packaging for uninterrupted automated pick-and-place SMT assembly at high production volumes
What is TFM-123-01-SM-D-A-P-TR used for?
The TFM-123-01-SM-D-A-P-TR is intended for dense multi-channel interfaces on FPGA daughter cards, communication protocol bridge modules, and compact industrial I/O boards where 46 signals must be routed through a fine-pitch 0.050 inch connector. The tape-and-reel format and SMT footprint make it ideal for high-volume automated assembly, while its Tiger Eye contacts provide reliable performance across repeated mating cycles in test and production environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-123-01-SM-D-A-P-TR datasheet?
TFM-123-01-SM-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-123-01-SM-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does TFM-123-01-SM-D-A-P-TR achieve 46 contacts in roughly half the board space of a standard-pitch alternative?
The TFM-123-01-SM-D-A-P-TR uses 0.050 inch (1.27 mm) pitch across 23 dual-row positions, producing a row length of approximately 29 mm for 46 contacts. An equivalent 0.100 inch (2.54 mm) pitch connector for 46 contacts would require about 58 mm of board length, making the TFM-123 solution nearly 50 percent more compact. This density gain is critical for FPGA mezzanine designs where PCB real estate directly affects product cost.
Which automated assembly parameters should engineers specify when placing TFM-123-01-SM-D-A-P-TR on a pick-and-place line?
The TFM-123-01-SM-D-A-P-TR ships in tape-and-reel format with component pitch set for standard SMT feeders. Engineers should specify a nozzle diameter appropriate for the connector body width, typically 2 to 3 mm, and set placement force below 5 N to avoid deflecting the fine 0.050 inch pitch pads. Reflow profiles follow lead-free J-STD-020 guidelines with a peak temperature of 260°C for no more than 30 seconds.
How does TFM-123-01-SM-D-A-P-TR compare to TFM-115-01-S-D-A-P-TR for a design that needs exactly 46 signals?
TFM-115-01-S-D-A-P-TR provides only 30 contacts across 15 positions, which falls short of a 46-signal requirement. TFM-123-01-SM-D-A-P-TR's 23 positions deliver exactly 46 contacts at the same 0.050 inch (1.27 mm) pitch, adding only about 10 mm of row length over the 15-position variant. Choosing the 23-position part avoids the need to use 2 connectors in parallel, simplifying PCB layout and reducing bill-of-materials complexity.
What mating options and stack heights are available when using TFM-123-01-SM-D-A-P-TR in a board-to-board stack?
TFM-123-01-SM-D-A-P-TR mates with SAMTEC's corresponding 23-position TFM-series Tiger Eye receptacle strips. SAMTEC offers board-to-board stack heights from approximately 4 mm to over 20 mm in 2 mm increments for this series. Gold over nickel contacts on both connector halves ensure signal integrity for signals up to several hundred MHz, and the full -55°C to +125°C operating range covers both commercial and industrial application environments.
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