TFM-123-01-LM-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-123-01-LM-D-A-P-TR is a 46-position dual-row high-reliability Tiger Eye terminal strip with 0.050 inch pitch and low-mount SMT footprint in tape-and-reel packaging. Offers gold-plated contacts for minimal contact resistance in dense PCB assemblies. Available with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 46
- Lifecycle
- ACTIVE
- Datasheet
- TFM-123-01-LM-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-123-01-LM-D-A-P-TR?
- 46-position dual-row 0.050 inch (1.27 mm) pitch layout for high-density SMT signal interfaces on compact PCBs
- Low-mount (LM) profile reduces installed height, enabling board-to-board stacking clearances below 5 mm
- Tiger Eye gold-plated contacts deliver contact resistance below 10 milliohms for reliable high-speed signal transmission
What is TFM-123-01-LM-D-A-P-TR used for?
The TFM-123-01-LM-D-A-P-TR is designed for high-density, low-profile board-to-board interconnect applications in telecommunications, industrial computing, and instrumentation. Its 46-position dual-row 0.050 inch pitch format supports dense I/O routing on FPGA boards, DSP modules, and high-speed data acquisition systems. The low-mount configuration and tape-and-reel packaging make it well suited for automated SMT assembly in volume production environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-123-01-LM-D-A-P-TR datasheet?
TFM-123-01-LM-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-123-01-LM-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the low-mount (LM) feature of the TFM-123-01-LM-D-A-P-TR affect PCB stack height?
The low-mount (LM) designation on the TFM-123-01-LM-D-A-P-TR reduces the mated connector height to less than 5 mm above the PCB surface. This compact profile is essential for board-to-board stacking applications in server blades, embedded computing modules, and portable instrumentation where overall chassis height must be minimized while maintaining 46-position dual-row signal connectivity.
For which high-speed signal applications is the 0.050 inch pitch of the TFM-123-01-LM-D-A-P-TR appropriate?
The 0.050 inch (1.27 mm) pitch and gold-plated Tiger Eye contacts of the TFM-123-01-LM-D-A-P-TR support signal frequencies exceeding 1 GHz, making it suitable for high-speed LVDS, SERDES, and parallel bus interfaces on 46-position dual-row connectors. Applications include FPGA mezzanine boards, DSP carrier cards, and high-speed data acquisition front-ends requiring low contact resistance below 10 milliohms.
What procurement advantages does tape-and-reel packaging provide for the TFM-123-01-LM-D-A-P-TR in volume production?
The tape-and-reel (TR) format of the TFM-123-01-LM-D-A-P-TR allows automated pick-and-place machines to handle these 46-position SMT connectors at high throughput rates, typically exceeding 500 placements per hour. This packaging reduces manual handling, minimizes placement errors, and is compatible with standard 8 mm or 12 mm SMT feeder systems, which lowers per-unit assembly cost in medium and high-volume PCB production runs.
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