TFM-121-04-SM-D-LC SAMTEC Connector (Other) In Stock
SAMTEC TFM-121-04-SM-D-LC is a Tiger Eye terminal strip connector with 0.050-inch pitch, dual-row surface-mount design featuring 42 positions. Engineered for high-reliability low-profile board-to-board mating with fine-pitch signal density. Available from SAMTEC with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 42
- Lifecycle
- ACTIVE
- Datasheet
- TFM-121-04-SM-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-121-04-SM-D-LC?
- 0.050-inch (1.27 mm) pitch delivers twice the signal density of standard 0.100-inch connectors in the same footprint
- Tiger Eye contact technology provides wiping action for low-resistance, high-cycle mating reliability
- Surface-mount termination enables automated reflow assembly compatible with standard 260°C solder profiles
What is TFM-121-04-SM-D-LC used for?
The TFM-121-04-SM-D-LC suits compact mezzanine and board-to-board interconnect designs in networking equipment, industrial automation, and portable instrumentation. Its 42-position dual-row layout at 0.050-inch pitch gives engineers high signal count within a minimal PCB area, supporting both single-ended and differential signal pairs. The SMT footprint integrates seamlessly with pick-and-place assembly, reducing hand-soldering labor in volume production.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-121-04-SM-D-LC datasheet?
TFM-121-04-SM-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-121-04-SM-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What position count and pitch does the TFM-121-04-SM-D-LC provide, and how does this affect routing density?
The TFM-121-04-SM-D-LC offers 42 total positions in a dual-row layout at 0.050-inch (1.27 mm) pitch, yielding 21 contacts per row. This fine pitch allows routing approximately twice the signals of a 0.100-inch header in the same board length, making it valuable for FPGA and SoC interfaces with more than 30 signal connections.
Which assembly processes are compatible with the TFM-121-04-SM-D-LC surface-mount footprint?
The TFM-121-04-SM-D-LC is designed for standard SMT reflow assembly with a peak temperature tolerance of 260°C per IPC/JEDEC J-STD-020. It works with automated pick-and-place equipment, and the dual-row pad pattern is compatible with standard 0.050-inch pitch land grids used across mainstream PCB layout tools, cutting NPI cycle time by eliminating manual soldering steps.
For a compact telecom line card, how does the TFM-121-04-SM-D-LC compare to a standard 0.100-inch dual-row header?
Relative to a 0.100-inch dual-row header carrying the same 42 signals, the TFM-121-04-SM-D-LC halves the connector body length from approximately 54 mm to 27 mm, freeing significant PCB area for other components on dense telecom line cards where backplane connector spacing is typically under 30 mm.
How does Tiger Eye contact technology extend the service life of the TFM-121-04-SM-D-LC in high-cycle maintenance environments?
Tiger Eye contacts use a dual-beam wiping interface that displaces surface oxide layers on each insertion, maintaining contact resistance below 20 milliohms across a rated cycle life exceeding 200 mating cycles. This reliability advantage matters in field-replaceable module designs where line cards may be swapped multiple times per year over a 10-year equipment lifespan.
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