TFM-120-32-S-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-120-32-S-D-A-P-TR is a 40-position, 1.27 mm pitch dual-row surface mount fine-pitch terminal strip with gold-over-nickel mating contacts and peg board mounting. It supports high-density board-to-board connections in compact, high-reliability PCB assemblies. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 40
- Lifecycle
- ACTIVE
- Datasheet
- TFM-120-32-S-D-A-P-TR Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 1.27 mm fine-pitch dual-row layout provides 40 positions in a body only 1.325 inch long, maximizing signal density
- Gold-over-nickel mating contact finish ensures low contact resistance below 20 milliohms with excellent corrosion resistance
- Peg (P) board mounting option mechanically locks the connector to the PCB before soldering, preventing movement during reflow
- Tape-and-reel (TR) packaging enables high-speed automated SMT pick-and-place assembly
Applications
TFM-120-32-S-D-A-P-TR is suited for high-density board-to-board interconnects in telecommunications line cards, server memory modules, and FPGA mezzanine designs where 40 signals must be routed within a 1.325 inch connector footprint. Its fine 1.27 mm pitch and peg mounting make it a preferred choice for compact embedded computing hardware subjected to vibration in industrial and defense environments. The gold-over-nickel contact finish supports demanding signal integrity requirements at data rates up to several Gbps.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 7 Weeks, 1 Day |
| YTEOL | 9.4 |
| Board Mounting Option | PEG |
| Body Breadth | 0.225inch |
| Body Depth | 0.435inch |
| Body Length | 1.325inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD OVER NICKEL |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.429mm |
| Rated Current (Signal) | 3.2A |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 40 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Mainland China, Malaysia |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does TFM-120-32-S-D-A-P-TR achieve reliable PCB retention before solder reflow?
TFM-120-32-S-D-A-P-TR includes a peg (P) board mounting feature, which consists of plastic pegs that snap into holes in the PCB and hold the 40-position connector firmly in place during the SMT reflow process at temperatures up to 260 degrees C. This prevents the 1.27 mm fine-pitch connector from shifting on the board, ensuring all pads are properly aligned during soldering and reducing the risk of solder bridging between the closely spaced contacts.
What contact finish does TFM-120-32-S-D-A-P-TR use, and how many mating cycles does it support?
The mating contacts of TFM-120-32-S-D-A-P-TR are finished with gold over nickel, providing a contact resistance typically below 20 milliohms. Gold plating is rated for a minimum of 30 mate-unmate cycles under standard testing conditions, making this 40-position connector suitable for removable module interfaces such as test daughtercards or field-replaceable I/O panels. The nickel barrier beneath the gold prevents diffusion and extends contact longevity in humid operating environments.
How compact is TFM-120-32-S-D-A-P-TR compared to a standard 2.54 mm pitch 40-position dual-row connector?
TFM-120-32-S-D-A-P-TR uses a 1.27 mm pitch versus the standard 2.54 mm pitch, reducing the connector body length to 1.325 inches for 40 positions compared to approximately 2.6 inches for an equivalent 2.54 mm part. The body depth is 0.435 inch and breadth is 0.225 inch, providing a footprint reduction of roughly 50 percent in the pitch direction. This space saving is critical in high-density server blade or FPGA mezzanine card designs where board area is at a premium.
Which board mounting style does TFM-120-32-S-D-A-P-TR support, and does it offer a through-hole alternative for higher pull-out strength?
TFM-120-32-S-D-A-P-TR is designed for surface mount assembly with a peg (P) board retention option, anchoring the connector body mechanically before soldering. The peg adds meaningful pull-out resistance that exceeds pure SMT pad adhesion by several Newtons. For applications requiring even higher retention, SAMTEC offers through-hole tail variants within the TFM series that can provide pull-out forces exceeding 20 N per contact row, though these require via drilling and may not suit fine-pitch panel densities.
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