TFM-120-32-L-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-120-32-L-D-A-P-TR is a 40-position dual-row board stacking SMT connector at 0.050 inch pitch, featuring phosphor bronze contacts with 15 microinch gold over 50 microinch nickel mating finish, tape-and-reel packaging, and JESD-609 e3 RoHS-compliant lead-free termination for high-reliability board-to-board interconnect.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 40
- Lifecycle
- ACTIVE
- Datasheet
- TFM-120-32-L-D-A-P-TR Datasheet PDF
- Category
- Connector
- Price
- From $4.2800(MOQ 1)
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-120-32-L-D-A-P-TR?
- 40-position dual-row board stacking connector on 0.050 inch (1.27mm) pitch
- Phosphor bronze contacts with 15 microinch gold over 50 microinch nickel mating surface
- Tin over nickel barrier termination finish (JESD-609 e3, RoHS lead-free)
- Tape-and-reel (-TR) packaging for automated high-volume SMT assembly
- Board stacking connector type for direct PCB-to-PCB signal interconnect
- 7-week factory lead time; plan procurement accordingly for production schedules
What is TFM-120-32-L-D-A-P-TR used for?
The TFM-120-32-L-D-A-P-TR is used in board-to-board stacking architectures found in embedded computing modules, networking line cards, and industrial control systems where 40-position 0.050 inch pitch dual-row SMT connectors are required for dense, reliable signal connections. Its gold-over-nickel mating contact finish ensures low contact resistance and long service life, making it suitable for high-cycle applications in test equipment and communications hardware.
What are the specifications of TFM-120-32-L-D-A-P-TR?
| Factory Lead Time | 7 Weeks, 2 Days |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD (15) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Material | PHOSPHOR BRONZE |
| JESD-609 Code | e3 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Mainland China, Malaysia |
Where can I find the TFM-120-32-L-D-A-P-TR datasheet?
TFM-120-32-L-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-120-32-L-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What are the contact finish specifications on TFM-120-32-L-D-A-P-TR and why does gold plating thickness matter?
The TFM-120-32-L-D-A-P-TR uses phosphor bronze contacts with 15 microinch gold plating over 50 microinch nickel on the mating surface, and tin with a nickel barrier on the termination side. The 15 microinch gold thickness ensures reliable low-resistance contact over many mating cycles, preventing corrosion in signal-critical board stacking applications.
How does the 0.050 inch pitch dual-row configuration affect PCB footprint density compared to 0.100 inch pitch connectors?
At 0.050 inch (1.27mm) pitch, the TFM-120-32-L-D-A-P-TR achieves twice the pin density of a standard 0.100 inch pitch connector, fitting 40 positions into approximately the same footprint length as a 20-position 0.100 inch part. This makes it valuable for compact embedded modules and small form-factor boards where space is constrained.
What is the factory lead time for TFM-120-32-L-D-A-P-TR and how should procurement teams plan for it?
The factory lead time for TFM-120-32-L-D-A-P-TR is approximately 7 weeks and 2 days. Procurement teams designing high-density 40-position board stacking interconnects into production schedules should order this connector at least 8 to 10 weeks in advance to avoid delays, especially for programs requiring tape-and-reel automated SMT assembly.
Is TFM-120-32-L-D-A-P-TR RoHS compliant and suitable for lead-free solder assembly processes?
Yes. The TFM-120-32-L-D-A-P-TR carries a JESD-609 e3 code, indicating a lead-free (Pb-free) termination finish compatible with RoHS-compliant manufacturing. The tin over nickel barrier termination is designed for standard lead-free SMT reflow profiles used in modern PCB assembly for commercial, industrial, and telecom applications.
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Why Buy from FindMyChip
About SAMTEC
SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $7.6500 | $7.65 |
| 10+ | $6.4990 | $64.99 |
| 50+ | $5.1100 | $255.50 |
| 100+ | $4.6900 | $469.00 |
| 200+ | $4.4200 | $884.00 |
| 500+ | $4.2800 | $2140.00 |
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Response within 24 hours · Worldwide shipping
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