TFM-120-32-L-D-A-P-TR SAMTEC Connector (Other) In Stock

SAMTEC TFM-120-32-L-D-A-P-TR is a 40-position dual-row board stacking SMT connector at 0.050 inch pitch, featuring phosphor bronze contacts with 15 microinch gold over 50 microinch nickel mating finish, tape-and-reel packaging, and JESD-609 e3 RoHS-compliant lead-free termination for high-reliability board-to-board interconnect.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TFM-120-32-L-D-A-P-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
40
Lifecycle
ACTIVE
Category
Connector
Price
From $4.2800(MOQ 1)
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of TFM-120-32-L-D-A-P-TR?

  • 40-position dual-row board stacking connector on 0.050 inch (1.27mm) pitch
  • Phosphor bronze contacts with 15 microinch gold over 50 microinch nickel mating surface
  • Tin over nickel barrier termination finish (JESD-609 e3, RoHS lead-free)
  • Tape-and-reel (-TR) packaging for automated high-volume SMT assembly
  • Board stacking connector type for direct PCB-to-PCB signal interconnect
  • 7-week factory lead time; plan procurement accordingly for production schedules

What is TFM-120-32-L-D-A-P-TR used for?

The TFM-120-32-L-D-A-P-TR is used in board-to-board stacking architectures found in embedded computing modules, networking line cards, and industrial control systems where 40-position 0.050 inch pitch dual-row SMT connectors are required for dense, reliable signal connections. Its gold-over-nickel mating contact finish ensures low contact resistance and long service life, making it suitable for high-cycle applications in test equipment and communications hardware.

What are the specifications of TFM-120-32-L-D-A-P-TR?

Factory Lead Time7 Weeks, 2 Days
Connector TypeBOARD STACKING CONNECTOR
Contact Finish MatingGOLD (15) OVER NICKEL (50)
Contact Finish TerminationTin (Sn) - with Nickel (Ni) barrier
Contact MaterialPHOSPHOR BRONZE
JESD-609 Codee3
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginMainland China, Malaysia

Where can I find the TFM-120-32-L-D-A-P-TR datasheet?

TFM-120-32-L-D-A-P-TR Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for TFM-120-32-L-D-A-P-TR?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What are the contact finish specifications on TFM-120-32-L-D-A-P-TR and why does gold plating thickness matter?

The TFM-120-32-L-D-A-P-TR uses phosphor bronze contacts with 15 microinch gold plating over 50 microinch nickel on the mating surface, and tin with a nickel barrier on the termination side. The 15 microinch gold thickness ensures reliable low-resistance contact over many mating cycles, preventing corrosion in signal-critical board stacking applications.

How does the 0.050 inch pitch dual-row configuration affect PCB footprint density compared to 0.100 inch pitch connectors?

At 0.050 inch (1.27mm) pitch, the TFM-120-32-L-D-A-P-TR achieves twice the pin density of a standard 0.100 inch pitch connector, fitting 40 positions into approximately the same footprint length as a 20-position 0.100 inch part. This makes it valuable for compact embedded modules and small form-factor boards where space is constrained.

What is the factory lead time for TFM-120-32-L-D-A-P-TR and how should procurement teams plan for it?

The factory lead time for TFM-120-32-L-D-A-P-TR is approximately 7 weeks and 2 days. Procurement teams designing high-density 40-position board stacking interconnects into production schedules should order this connector at least 8 to 10 weeks in advance to avoid delays, especially for programs requiring tape-and-reel automated SMT assembly.

Is TFM-120-32-L-D-A-P-TR RoHS compliant and suitable for lead-free solder assembly processes?

Yes. The TFM-120-32-L-D-A-P-TR carries a JESD-609 e3 code, indicating a lead-free (Pb-free) termination finish compatible with RoHS-compliant manufacturing. The tin over nickel barrier termination is designed for standard lead-free SMT reflow profiles used in modern PCB assembly for commercial, industrial, and telecom applications.

Why Buy from FindMyChip

Authorized Source
Verified supply chain with full traceability & inspection
Competitive Pricing
Factory-direct from China distributors, low MOQ
Fast Shipping
DHL Express 3–5 days · FedEx/UPS 5–7 days worldwide
Quality Guaranteed
30-day replacement for defective parts, no questions asked

About SAMTEC

SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
From $4.2800
Buy from 1pc · Factory-direct pricing
Qty.Unit PriceExt. Price
1+$7.6500$7.65
10+$6.4990$64.99
50+$5.1100$255.50
100+$4.6900$469.00
200+$4.4200$884.00
500+$4.2800$2140.00
pcs
Unit price: $7.6500 · Total: $7.65

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Response time is incredible — usually under 4 hours. They understand that production lines can't wait.

JW
James Wright
Supply Chain Director, CircuitPro Ltd, UK