TFM-120-02-S-D SAMTEC Connector (Other) In Stock
SAMTEC TFM-120-02-S-D is a 40-position dual-row board stacking receptacle connector with 0.050 inch (1.27 mm) pitch, measuring 1.125 x 0.225 inches, with tin-over-nickel contact finish and RoHS compliance. Available from stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 40
- Lifecycle
- ACTIVE
- Datasheet
- TFM-120-02-S-D Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 40-position dual-row board stacking receptacle at 0.050 inch pitch in a compact 1.125 inch x 0.225 inch body
- Tin (Sn) over nickel (Ni) barrier contact termination providing RoHS-compliant solderable finish
- Low factory lead time of 1 week enabling fast procurement for prototype and production schedules
- Male contact gender in a receptacle housing designed for precision board-to-board stacking applications
Applications
The TFM-120-02-S-D is used in board stacking and mezzanine interconnect applications where 40 dual-row contacts at 1.27 mm pitch must bridge two PCBs in a compact 1.125 inch body length. It is well suited for embedded modules, FPGA development platforms, and compact industrial controllers where a reliable solder-terminated SMT receptacle is needed with short lead times.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 8.75 |
| Body Breadth | 0.225inch |
| Body Length | 1.125inch |
| Body/Shell Style | RECEPTACLE |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | NOT SPECIFIED |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mixed Contacts | NO |
| Mounting Option 1 | GUIDE SLOT |
| Mounting Option 2 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 30u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 3.2A |
| Reference Standard | UL, CSA |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 40 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What are the body dimensions of TFM-120-02-S-D, and how do they determine the PCB footprint for board stacking?
The TFM-120-02-S-D has a body length of 1.125 inches (28.6 mm) and body breadth of 0.225 inches (5.7 mm), defining the minimum PCB keep-out area for the connector. This 28.6 mm x 5.7 mm envelope accommodates 40 contacts at 1.27 mm pitch in dual rows, allowing PCB designers to plan routing channels around the footprint for 3.3 V and 5 V digital signal lines on mezzanine boards.
What contact termination finish does TFM-120-02-S-D use, and is it compatible with lead-free reflow soldering?
The TFM-120-02-S-D uses tin (Sn) with a nickel (Ni) barrier for contact termination, which is compatible with lead-free reflow soldering at peak temperatures up to 260 °C per J-STD-020. The tin finish provides reliable solder wetting on SMT pads and the nickel barrier prevents tin migration into the copper contacts, ensuring long-term solder joint integrity on boards rated for 1000-hour operational lifetimes.
How quickly can TFM-120-02-S-D be sourced, and what does the 1-week factory lead time mean for prototyping?
The TFM-120-02-S-D has a factory lead time of 1 week, enabling rapid procurement for design iteration cycles. Engineers prototyping 40-pin dual-row board stacking configurations can receive components within days versus the 12-to-21 week lead times common on specialty connectors, accelerating development timelines for FPGA boards, sensor modules, and embedded computing platforms at 0.050 inch pitch.
When should a designer choose TFM-120-02-S-D over a higher pin count SAMTEC stacking connector?
A designer selects the 40-pin TFM-120-02-S-D over larger variants (such as 60-pin or 80-pin SAMTEC TFM connectors) when the interface requires exactly 40 signals, minimizing connector body length from 28.6 mm to values below competitors while maintaining the same 1.27 mm pitch SMT footprint. This choice reduces material cost per unit, shortens PCB routing runs on power-constrained 3.3 V boards, and simplifies mechanical layout in small-form-factor embedded modules.
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