TFM-115-32-S-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-115-32-S-D-A-K-TR is a 30-position dual-row board stacking connector with gold (30 µin) over nickel phosphor bronze male contacts and tin termination. Designed for reliable PCB-to-PCB stacking in compact embedded systems. Available on tape-and-reel from authorized distributors worldwide.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 30
- Lifecycle
- ACTIVE
- Datasheet
- TFM-115-32-S-D-A-K-TR Datasheet PDF
- Category
- Connector
- Price
- From $3.4602(MOQ 1)
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-115-32-S-D-A-K-TR?
- Board stacking connector with gold (30 µin) contact finish on phosphor bronze for reliable low-resistance interconnections across stacked PCBs
- Dual-row configuration provides 30 positions in a compact 0.875" x 0.225" body for high-density mezzanine or stacked board applications
- Tape-and-reel (TR) packaging enables automated SMT pick-and-place assembly for high-volume production efficiency
What is TFM-115-32-S-D-A-K-TR used for?
TFM-115-32-S-D-A-K-TR is suited for compact embedded computing modules, mezzanine card interconnects, and industrial control systems that require a reliable dual-row board stacking connector at fine pitch. Its gold-plated phosphor bronze contacts and tape-and-reel delivery support high-volume automated SMT assembly in consumer electronics, communications hardware, and test equipment.
What are the specifications of TFM-115-32-S-D-A-K-TR?
| Factory Lead Time | 10Weeks |
| YTEOL | 8.75 |
| Body Breadth | 0.225inch |
| Body Depth | 0.435inch |
| Body Length | 0.875inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD (30) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| Durability | 10000Cycles |
| Filter Feature | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mating Information | MULTIPAL MATING PARTS AVAILBLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 4.32mm |
| Plating Thickness | 30u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 3.7A |
| Reference Standard | UL |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 30 |
| UL Flammability Code | 94V-0 |
| Withdrawl Force-Min | 3.336N |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Where can I find the TFM-115-32-S-D-A-K-TR datasheet?
TFM-115-32-S-D-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-115-32-S-D-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact finish and material does the TFM-115-32-S-D-A-K-TR use for board stacking reliability?
TFM-115-32-S-D-A-K-TR uses phosphor bronze male contacts plated with gold (30 µin) over nickel barrier for the mating surface, and tin with nickel barrier for termination. The 30 µin gold thickness provides excellent corrosion resistance and low contact resistance for dependable performance in board stacking applications.
What are the body dimensions of TFM-115-32-S-D-A-K-TR and how do they affect stacked PCB designs?
The TFM-115-32-S-D-A-K-TR measures 0.875" in length, 0.225" in breadth, and 0.435" in depth, defining the stacking height and footprint for mezzanine assemblies. The 0.435" depth sets the inter-board spacing in a stacked PCB system, which is a critical parameter for enclosure fit and airflow management in compact embedded designs.
When is TFM-115-32-S-D-A-K-TR preferable for high-volume SMT production compared to through-hole board stacking connectors?
The TR (tape-and-reel) packaging of TFM-115-32-S-D-A-K-TR is specifically designed for automated SMT pick-and-place assembly, reducing manual loading time and improving placement repeatability on high-speed assembly lines. Unlike through-hole alternatives requiring wave soldering or hand placement, this connector integrates into standard reflow processes, cutting assembly time and cost for large production runs.
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Why Buy from FindMyChip
About SAMTEC
SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $7.3800 | $7.38 |
| 10+ | $6.2710 | $62.71 |
| 50+ | $4.9300 | $246.50 |
| 100+ | $4.5100 | $451.00 |
| 200+ | $4.1162 | $823.25 |
| 1000+ | $3.4602 | $3460.24 |
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