TFM-115-21-S-D SAMTEC Connector (Other) In Stock
Samtec TFM-115-21-S-D is a 30-position dual-row SMT board receptacle connector with 0.050" (1.27 mm) pitch, 30 µin gold over nickel contact finish, and ELP for extended life performance. Designed for high-reliability board-to-board interconnects in compact embedded systems. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 30
- Lifecycle
- ACTIVE
- Datasheet
- TFM-115-21-S-D Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 30-position dual-row receptacle at 0.050" (1.27 mm) pitch for high-density board-to-board interconnects
- 30 µin gold over 50 µin nickel contact finish ensuring low contact resistance and corrosion resistance over thousands of mating cycles
- E.L.P. (Extended Life Performance) plating option providing enhanced durability for high-cycle interconnect applications
- RoHS-compliant construction with tin-over-nickel termination finish suitable for lead-free SMT reflow processes
Applications
The TFM-115-21-S-D is suited for high-reliability board-to-board signal interconnects in embedded computing modules, instrumentation daughtercards, and medical device electronics requiring 30-position dual-row mating at 0.050" pitch. The 30 µin gold contact finish and ELP plating make it ideal for applications demanding tens of thousands of mating cycles without degraded contact resistance. Its compact body measuring 0.875" x 0.225" enables dense PCB layouts in small form-factor designs.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 2 Weeks, 6 Days |
| YTEOL | 9.15 |
| Additional Feature | E.L.P. |
| Body Breadth | 0.225inch |
| Body Length | 0.875inch |
| Body/Shell Style | RECEPTACLE |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | GUIDE SLOT |
| Mounting Option 2 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 30u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 3.2A |
| Reference Standard | UL, CSA |
| Terminal Pitch | 1.27mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 30 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the E.L.P. designation mean on the TFM-115-21-S-D, and in what applications does it provide the most benefit?
E.L.P. stands for Extended Life Performance, a SAMTEC plating specification combining 30 µin gold over 50 µin nickel on the contact mating surface. This finish is rated for significantly more mating cycles than standard 15 µin gold, making TFM-115-21-S-D the preferred choice in test-and-measurement fixtures, hot-swap module carriers, and field-replaceable units expected to undergo hundreds to thousands of insertion-removal cycles.
How many positions does the TFM-115-21-S-D provide, and what footprint does the connector occupy on the PCB?
The TFM-115-21-S-D provides 30 positions across 2 rows at 0.050" (1.27 mm) pitch, with a body length of 0.875" and body breadth of 0.225". This compact footprint fits 30 signal connections in under 22 mm of board length, enabling high-density layouts in embedded SoC modules, FPGA boards, and compact industrial controllers where board real estate is limited.
Is the TFM-115-21-S-D compatible with lead-free SMT reflow processes, and what termination finish is used?
Yes, the TFM-115-21-S-D is RoHS compliant and uses a tin (Sn) over nickel (Ni) barrier termination finish on its SMT pads, making it fully compatible with lead-free reflow soldering at peak temperatures up to 260°C. The nickel barrier layer prevents tin whisker growth and solder leaching, ensuring solder joint reliability over the product lifetime in industrial and commercial temperature ranges.
When would an engineer choose TFM-115-21-S-D over a lower-cost standard-plated alternative for board-to-board connections?
Engineers select TFM-115-21-S-D over standard 15 µin gold connectors when the design demands more than 500 mating cycles or operates in humid or mildly corrosive environments where thinner gold platings may degrade. The 30 µin gold with 50 µin nickel barrier on all 30 contacts keeps contact resistance below 20 mΩ even after extended cycling, critical in automated test equipment, medical diagnostics, and industrial hot-swap modules.
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