TFM-110-22-S-D-K-TR SAMTEC Connector (Other) In Stock
The TFM-110-22-S-D-K-TR is a 20-position dual-row surface-mount vertical Tiger Eye terminal strip from Samtec with 0.050" pitch and gold-over-nickel contact finish. Phosphor bronze contacts provide reliable mating in high-density board-to-board applications. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 20
- Lifecycle
- ACTIVE
- Datasheet
- TFM-110-22-S-D-K-TR Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Tiger Eye contact design with 30 micro-inch gold over 50 micro-inch nickel finish delivers low contact resistance and extended mating cycle reliability
- 20-position dual-row layout on 0.050" (1.27mm) pitch enables high-density vertical board-to-board connections in compact embedded modules
- Phosphor bronze contact material provides consistent spring force retention across thousands of insertion cycles in industrial and instrumentation applications
Applications
The TFM-110-22-S-D-K-TR is designed for high-density vertical board-to-board interconnects in embedded computing, FPGA modules, and instrumentation where the 0.050" pitch minimizes footprint. The gold-over-nickel contact finish makes it suitable for applications demanding low and stable contact resistance, such as high-speed signal headers on mezzanine cards and data acquisition modules. Tape-and-reel packaging supports high-volume automated SMT assembly in production environments.
Specifications
| YTEOL | 9.4 |
| Body Breadth | 0.225inch |
| Body Depth | 0.36inch |
| Body Length | 0.625inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.429mm |
| Plating Thickness | 30u inch |
| Rated Current (Signal) | 3.2A |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 20 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | France, Malaysia |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact finish does the TFM-110-22-S-D-K-TR use, and how does it affect connector longevity?
The TFM-110-22-S-D-K-TR uses 30 micro-inch gold over 50 micro-inch nickel on the mating contacts and tin with a nickel barrier on the termination side. The 30 micro-inch gold thickness provides corrosion resistance and low, stable contact resistance over multiple mating cycles, making it suitable for board-to-board mezzanine sockets that must be mated and unmated repeatedly during prototyping and field upgrades.
How does the 0.050" pitch of the TFM-110-22-S-D-K-TR compare with standard 0.100" connectors for space-constrained designs?
The 0.050" (1.27mm) pitch packs contacts at twice the density of 0.100" (2.54mm) connectors, so a 20-position TFM header occupies roughly the same board length as a 10-position standard-pitch header. In a compact embedded module where PCB area is limited to less than 25mm x 25mm, this density advantage allows a full 20-pin interface to be routed in the same footprint previously needed for fewer signals.
What are the physical body dimensions of the TFM-110-22-S-D-K-TR, and how does this influence PCB layout planning?
The connector body measures 0.625 inches long, 0.225 inches wide, and 0.36 inches deep. Knowing these dimensions allows PCB layout engineers to accurately plan keepout zones around the connector, verify clearance from adjacent tall components, and ensure the vertical mating direction clears any enclosure lid or shield can positioned above the board.
Is the TFM-110-22-S-D-K-TR compatible with Samtec SFM series sockets for mezzanine board stack designs?
Yes, Samtec's TFM series 0.050" pitch headers are designed to mate with SFM series surface-mount socket strips, forming a matched board-to-board connector pair. This allows engineers to design mezzanine stacks where a daughter card carrying an FPGA, RF module, or memory sits 2mm to 20mm above a main carrier board, with all 20 signals and power lines routed through the matched TFM-SFM connector pair.
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