TFM-110-02-S-D-LC SAMTEC Connector (Other) In Stock
Samtec TFM-110-02-S-D-LC is a 20-position, 2-row, 1.27mm pitch straight PCB header with split board-lock and gold-over-nickel contact finish. It provides reliable board-to-board or board-to-cable connections in compact 0.050-inch pitch applications. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 20
- Lifecycle
- ACTIVE
- Datasheet
- TFM-110-02-S-D-LC Datasheet PDF
- Category
- Connector
- Temp Range
- -65.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 20-position dual-row 1.27mm (0.050 inch) pitch layout for high-density interconnect in minimal PCB area
- Gold (30µin) over nickel (50µin) contact finish ensuring low contact resistance and long mating cycle life
- Split board-lock mechanism providing mechanical retention and strain relief for secure PCB mounting
- Straight through-hole mounting orientation compatible with standard PCB drilling and wave soldering processes
Applications
The TFM-110-02-S-D-LC is used in high-density board-to-board and board-to-cable interconnect applications in test and measurement equipment, embedded computing modules, and industrial control systems. Its 1.27mm pitch dual-row layout accommodates 20 signal contacts in a 0.625-inch body length, making it suited for compact mezzanine or daughter-card configurations. The gold contact finish and split board-lock provide durability and retention in environments subject to vibration or repeated mating cycles.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 9.4 |
| Additional Feature | NONE |
| Board Mounting Option | SPLIT BOARD LOCK |
| Body Breadth | 0.225inch |
| Body Depth | 0.225inch |
| Body Length | 0.625inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Dielectric Withstanding Voltage | 600VAC V |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 5000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 30u inch |
| Polarization Key | SHRD ENDS |
| Rated Current (Signal) | 3.2A |
| Reference Standard | UL |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 20 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, Vietnam |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does TFM-110-02-S-D-LC provide, and what is its pitch?
The TFM-110-02-S-D-LC is a 20-position connector arranged in 2 rows on a 1.27mm (0.050 inch) pitch. This high-density layout supports 10 contacts per row in a body length of approximately 0.625 inches, enabling compact board-to-board signal routing in space-constrained PCB designs.
What contact plating does TFM-110-02-S-D-LC use and why does it matter for signal integrity?
The mating contacts are plated with 30 microinches of gold over 50 microinches of nickel. This bi-metallic finish provides low and stable contact resistance across thousands of mating cycles, supporting reliable high-frequency signal transmission at data rates typical of modern embedded computing and test equipment interconnects.
In which industrial or instrumentation applications is TFM-110-02-S-D-LC a strong fit?
The connector is well-suited to mezzanine board stacking in test and measurement instruments, FPGA evaluation boards, and ruggedized industrial computing modules where a 20-position dual-row header on a 1.27mm pitch fits within tight board outlines. The split board-lock retains the connector under vibration loads common in field-deployed industrial environments.
What is the body size of TFM-110-02-S-D-LC and how does it compare to standard 2.54mm pitch headers?
The TFM-110-02-S-D-LC body measures approximately 0.625 inches long by 0.225 inches wide by 0.225 inches deep. Its 1.27mm pitch is half the spacing of a standard 2.54mm pitch header, reducing the footprint for 20 positions to roughly half the PCB area required by an equivalent 2.54mm dual-row connector.
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