TFM-107-05-S-D-LC SAMTEC Connector (Other) In Stock
SAMTEC TFM-107-05-S-D-LC is a high-reliability Tiger Eye terminal strip with 0.050" pitch, 7 dual-row positions, single-row SMT mounting, and low-clearance design for compact board stacking. Gold-over-nickel contacts ensure reliable interconnects. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 14
- Lifecycle
- ACTIVE
- Datasheet
- TFM-107-05-S-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-107-05-S-D-LC?
- 0.050" (1.27 mm) pitch dual-row terminal strip with 7 positions per row (14 total contacts) in a low-clearance (LC) single-row SMT configuration
- Tiger Eye high-reliability contact design provides positive wiping action for low contact resistance and dependable performance in high-cycle mating applications
- Low-clearance SMT mounting minimizes board-to-board stack height, enabling ultra-compact mezzanine designs in space-constrained electronic assemblies
What is TFM-107-05-S-D-LC used for?
The TFM-107-05-S-D-LC is suited for low pin-count mezzanine board stacking, sensor module interfaces, and compact embedded computing applications where minimal stack height is critical. Its 14-contact dual-row layout at 0.050-inch pitch enables high-density routing in tiny PCB footprints for IoT devices and wearable electronics. Engineers specify it in space-constrained industrial modules and medical device designs requiring reliable, repeatable board-to-board interconnects.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-107-05-S-D-LC datasheet?
TFM-107-05-S-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-107-05-S-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the total contact count of the TFM-107-05-S-D-LC and how are contacts arranged?
The TFM-107-05-S-D-LC provides 14 total contacts arranged in 2 rows of 7 positions at a 0.050 inch (1.27 mm) pitch. This compact dual-row configuration is ideal for low pin-count board stacking in IoT sensor modules and miniature embedded computing assemblies where PCB space is at a premium.
For a compact IoT sensor module, why choose TFM-107-05-S-D-LC over a 0.100-inch pitch connector?
The TFM-107-05-S-D-LC at 0.050-inch pitch occupies roughly half the board area of a 0.100-inch pitch connector with the same 14 contacts, enabling significantly smaller PCB footprints for IoT sensors. The low-clearance SMT design also reduces stack height by several millimeters compared to through-hole alternatives, critical for wearable and miniature device designs.
How does the LC (low-clearance) design of TFM-107-05-S-D-LC benefit multi-board assemblies?
The low-clearance design of TFM-107-05-S-D-LC reduces the board-to-board gap in mezzanine stacking configurations, allowing system designers to achieve tighter vertical integration. This is especially beneficial in portable electronics and rack-mount systems where total assembly thickness must be minimized while maintaining a reliable 14-contact interconnect at 0.050-inch pitch.
Is the TFM-107-05-S-D-LC compatible with standard SMT reflow soldering processes?
Yes, the TFM-107-05-S-D-LC is designed for SMT placement and reflow soldering, compatible with standard lead-free solder profiles up to 260°C peak reflow temperature. The single-row SMT termination pads are suitable for automated pick-and-place assembly, and the gold-over-nickel contact finish ensures reliable solder joint wetting and long-term connectivity.
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About SAMTEC
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