TFM-107-02-S-D SAMTEC Connector (Other) In Stock
SAMTEC TFM-107-02-S-D is a 14-position dual-row board stacking connector featuring 30 µin gold over 50 µin nickel mating contacts and phosphor bronze material, designed for reliable high-density board-to-board signal connections.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 14
- Lifecycle
- ACTIVE
- Datasheet
- TFM-107-02-S-D Datasheet PDF
- Category
- Connector
- Price
- From $1.4107(MOQ 50)
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-107-02-S-D?
- 30 µin gold over 50 µin nickel mating contact finish for outstanding wear resistance across 1000+ mating cycles
- Phosphor bronze contacts with tin-over-nickel termination ensuring robust solder joint integrity in lead-free assembly
- Compact dual-row 14-position layout measuring 0.475 × 0.225 inches for space-constrained board stacking applications
What is TFM-107-02-S-D used for?
The TFM-107-02-S-D is suited for high-reliability board stacking in industrial control systems, embedded processor modules, and communications equipment where consistent signal integrity across 14 positions is required. Its dual-row format enables dense 0.05-inch pitch interconnects between daughtercards and motherboards. The gold-plated contacts maintain low insertion loss over repeated mating cycles in automated test fixtures and field-serviceable designs.
What are the specifications of TFM-107-02-S-D?
| Reach Compliance Code | Compliant |
| Factory Lead Time | 1Week |
| YTEOL | 8.75 |
| Body Breadth | 0.225inch |
| Body Length | 0.475inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mixed Contacts | NO |
| Mounting Option 1 | GUIDE SLOT |
| Mounting Option 2 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 30u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 3.2A |
| Reference Standard | UL, CSA |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 14 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Where can I find the TFM-107-02-S-D datasheet?
TFM-107-02-S-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-107-02-S-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact plating specification does the TFM-107-02-S-D use and why does it matter for durability?
The TFM-107-02-S-D uses 30 µin gold over 50 µin nickel on mating contacts, providing excellent resistance to fretting corrosion and maintaining contact resistance below 20 mΩ over more than 1000 mating cycles, ideal for frequently serviced rack-mount modules.
How many positions does the TFM-107-02-S-D carry and what is its board footprint?
This dual-row connector provides 14 positions total on a 0.05-inch (1.27 mm) pitch within a body measuring 0.475 × 0.225 inches. The compact footprint allows placement in tight board areas while still routing 14 signal or power lines between stacked boards.
Can TFM-107-02-S-D be used in lead-free reflow soldering processes?
Yes. The TFM-107-02-S-D features a tin (Sn) with nickel (Ni) barrier termination finish, rated for lead-free reflow soldering at up to 260 °C peak temperature in compliance with RoHS and REACH directives, confirmed by REACH Compliant status.
When is TFM-107-02-S-D a strong candidate over single-row alternatives for board stacking?
For designs requiring 14 or more signal lanes in the smallest horizontal footprint, the dual-row TFM-107-02-S-D at 0.05-inch pitch is preferable over single-row 0.1-inch alternatives, reducing required board area by roughly 50% while maintaining the same 14-circuit count.
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About SAMTEC
SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 50+ | $2.1780 | $108.90 |
| 100+ | $2.0120 | $201.20 |
| 500+ | $1.9988 | $999.38 |
| 1000+ | $1.6831 | $1683.13 |
| 2500+ | $1.5437 | $3859.27 |
| 5000+ | $1.4107 | $7053.55 |
In Stock · 24h Response · Worldwide Shipping
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