TFM-106-01-L-D-RA SAMTEC Connector (Other) In Stock
The SAMTEC TFM-106-01-L-D-RA is a 12-position dual-row right-angle male board connector with 1.27 mm (0.050 inch) pitch and gold-over-nickel contact finish for reliable PCB edge interconnect. Its right-angle (RA) configuration enables horizontal mating perpendicular to the PCB plane, ideal for panel-edge or space-limited board layouts. RoHS compliant and available globally for immediate worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 12
- Lifecycle
- ACTIVE
- Datasheet
- TFM-106-01-L-D-RA Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 12-position dual-row right-angle (RA) male configuration at 1.27 mm (0.050 inch) pitch for compact horizontal PCB-edge interconnect
- Gold over nickel mating contact finish providing low contact resistance and corrosion resistance for reliable signal connections
- Right-angle termination enabling horizontal mating perpendicular to PCB surface for panel-mount or edge-connector layouts
- Tin-with-nickel-barrier SMT termination tails compatible with lead-free SAC305 reflow soldering up to 260 °C
- RoHS-compliant construction with 3-week factory lead time and 0.425 inch body length for space-constrained designs
Applications
The TFM-106-01-L-D-RA is suited for right-angle board-to-board interconnect on embedded processor modules, industrial HMI panels, and compact control PCBs where a horizontal mating connector profile reduces the assembly height above the PCB surface. Its 12-position dual-row layout accommodates mixed signal and power routing on edge-connector interfaces of single-board computers and peripheral expansion cards. The gold-over-nickel contact finish ensures reliable low-resistance connections in benign to moderately harsh operating environments across many mate-unmate cycles.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 3Weeks |
| YTEOL | 9.15 |
| Body Breadth | 0.225inch |
| Body Depth | 0.29inch |
| Body Length | 0.425inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD OVER NICKEL |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mixed Contacts | NO |
| Mounting Style | RIGHT ANGLE |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Rated Current (Signal) | 3.2A |
| Terminal Pitch | 1.27mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 12 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the TFM-106-01-L-D-RA offer for right-angle PCB-edge interconnect?
The TFM-106-01-L-D-RA provides 12 positions in a dual-row right-angle male configuration at 1.27 mm (0.050 inch) pitch, with 6 contacts per row. This pin count suits compact PCB-edge applications where 12 signal or power lines must route horizontally out of a board assembly, such as single-board computer expansion slots, HMI panel interconnects, and peripheral daughter cards requiring a low-profile right-angle connector footprint.
How does the right-angle (RA) orientation of the TFM-106-01-L-D-RA benefit panel-mount and edge-connector PCB designs?
The right-angle orientation of the TFM-106-01-L-D-RA positions the mating interface parallel to the PCB surface, reducing the above-board height from the typical 8 mm to 11 mm of vertical connectors down to the body depth of 0.29 inch (7.37 mm) protruding horizontally from the board edge. This is critical in panel-mounted enclosures where connectors must exit through a chassis cutout without exceeding an 8 mm board-to-panel clearance, common in rack-mount industrial and embedded computing products.
Why choose the TFM-106-01-L-D-RA gold-over-nickel contact finish over a gold-flash variant for instrumentation interconnect?
Gold over nickel provides a thicker, more uniform gold layer than gold flash, typically 15 µin to 30 µin versus 3 µin to 5 µin for flash finishes. This thicker layer withstands more mating cycles — typically 100 or more for gold-over-nickel versus 30 or fewer for gold flash — before the gold wears through to the nickel underplate, making TFM-106-01-L-D-RA the superior choice for instrumentation, test equipment, and frequently removed daughter cards where long-term contact integrity at below 30 mΩ is required.
What PCB keep-out dimensions should be planned around the TFM-106-01-L-D-RA body for adjacent component placement?
The TFM-106-01-L-D-RA body measures 0.425 inch (10.80 mm) in length, 0.225 inch (5.72 mm) in breadth, and 0.29 inch (7.37 mm) in depth. Designers should add at least 0.5 mm courtyard clearance on all sides per IPC-7351 guidelines, reserving a keep-out zone of approximately 11.8 mm x 6.7 mm in the horizontal plane plus 8 mm height in the right-angle mating direction to prevent mechanical interference with adjacent SMT components during board assembly and connector mating.
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