TFM-105-32-S-D-A-P-TR SAMTEC Connector (Other) In Stock
TFM-105-32-S-D-A-P-TR is a SAMTEC dual-row, 10-position board-to-board male connector with 0.50 mm pitch and 30 µin gold-over-nickel contact finish for reliable high-density interconnects. It features peg board mounting and tin-with-nickel-barrier termination for robust SMT attachment in tape-and-reel packaging. This fine-pitch connector suits high-speed computing modules, FPGAs, and compact embedded systems requiring dense, reliable board-to-board signal routing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 10
- Lifecycle
- ACTIVE
- Datasheet
- TFM-105-32-S-D-A-P-TR Datasheet PDF
- Category
- Connector
- Price
- From $1.8170(MOQ 1)
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-105-32-S-D-A-P-TR?
- 30 µin gold-over-nickel mating contact finish ensures low contact resistance and high insertion-cycle durability
- Dual-row 10-position layout provides high-density board-to-board connectivity in a compact 0.50 mm pitch footprint
- Peg (PEG) board mounting option improves mechanical stability during SMT reflow and in-field vibration
- Tape-and-reel (TR) packaging supports high-volume automated pick-and-place SMT production
- Tin-with-nickel-barrier termination finish improves solderability and resists copper diffusion for long-term joint reliability
What is TFM-105-32-S-D-A-P-TR used for?
The TFM-105-32-S-D-A-P-TR is designed for high-density board-to-board interconnects in compact computing modules, FPGA carrier cards, and advanced mezzanine card (AMC) systems where 0.50 mm pitch fine-pitch connectors are required. It is commonly used in telecommunications equipment, data center blade servers, and defense electronics that demand high pin-density with reliable 30 µin gold contact finishes for thousands of mating cycles. Its tape-and-reel packaging makes it a preferred choice for high-volume SMT production lines assembling miniaturized embedded systems.
What are the specifications of TFM-105-32-S-D-A-P-TR?
| Factory Lead Time | 4 Weeks, 1 Day |
| YTEOL | 9.4 |
| Board Mounting Option | PEG |
| Body Breadth | 0.225inch |
| Body Depth | 0.435inch |
| Body Length | 0.375inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.429mm |
| Plating Thickness | 30u inch |
| Rated Current (Signal) | 3.2A |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 10 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, Vietnam |
Where can I find the TFM-105-32-S-D-A-P-TR datasheet?
TFM-105-32-S-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-105-32-S-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact finish does TFM-105-32-S-D-A-P-TR use, and how many mating cycles does it support?
The TFM-105-32-S-D-A-P-TR uses 30 µin (microinches) gold over 50 µin nickel on its mating contacts. This gold-over-nickel finish provides low and stable contact resistance across hundreds to thousands of mating cycles, making it suitable for applications in test equipment and modules that require repeated board insertion and removal without degradation in signal integrity.
How does the peg mounting option on TFM-105-32-S-D-A-P-TR improve PCB assembly reliability?
The peg (PEG) board mounting option on the TFM-105-32-S-D-A-P-TR adds plastic pegs that insert into PCB holes, holding the connector in place with registration accuracy better than ±0.1 mm during SMT reflow at up to 260°C. This prevents connector tombstoning or shifting under solder paste surface tension forces, improving solder joint reliability in high-volume automated assembly.
Which high-speed board-to-board applications is TFM-105-32-S-D-A-P-TR best suited for?
The TFM-105-32-S-D-A-P-TR is ideal for high-speed board-to-board signal routing in FPGA mezzanine modules, data center blade server backplanes, and RF front-end boards where 0.50 mm pitch dual-row connectors are needed. It supports data rates in the multi-Gbps range per pair, making it suitable for PCIe, JESD204B, and LVDS interfaces on densely packed embedded computing boards.
Is TFM-105-32-S-D-A-P-TR available in tape-and-reel packaging for large production runs?
Yes, the -TR suffix designates tape-and-reel packaging, with connectors delivered on reels of typically 500 to 1000 pieces per reel for automated SMT assembly lines. This packaging format minimizes handling, reduces ESD risk to the 30 µin gold contacts, and is compatible with standard pick-and-place feeders used in IPC-compliant SMT production environments.
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About SAMTEC
SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $3.6100 | $3.61 |
| 10+ | $3.0650 | $30.65 |
| 100+ | $2.1200 | $212.00 |
| 175+ | $1.8930 | $331.28 |
| 525+ | $1.8813 | $987.66 |
| 1000+ | $1.8170 | $1817.00 |
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