TFM-105-32-L-D-LC SAMTEC Connector (Other) In Stock
SAMTEC TFM-105-32-L-D-LC is a 10-position dual-row male terminal strip with 0.050-inch pitch, surface-mount vertical orientation, and Tiger Eye contact technology for high-reliability board-to-board stacking. Features split board-lock mounting and tin-over-nickel termination finish. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 10
- Lifecycle
- ACTIVE
- Datasheet
- TFM-105-32-L-D-LC Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 10-position dual-row Tiger Eye male terminal strip on 0.050-inch (1.27 mm) pitch for compact, high-reliability board stacking interconnects
- Split board-lock mounting (E.L.P.) secures the connector mechanically to the PCB before soldering, preventing misalignment during reflow
- Tin (Sn) over nickel (Ni) barrier termination finish provides reliable solder joints with strong adhesion and diffusion barrier protection
- Vertical SMT orientation with compact body (0.375 inch length × 0.435 inch depth) suits space-constrained mezzanine and daughter-card assemblies
Applications
The TFM-105-32-L-D-LC is used in dual-row board-stacking applications for embedded computing, industrial control modules, and telecom daughter cards where a reliable 10-position, 0.050-inch pitch mezzanine interconnect is required. Its split board-lock feature supports automated SMT assembly by anchoring the connector during pick-and-place and reflow, reducing solder joint stress. Tiger Eye contact technology enables high mating cycle reliability for applications requiring frequent board-level reconfiguration or field upgrades.
Specifications
| YTEOL | 8.75 |
| Additional Feature | E.L.P., TIGER EYE |
| Board Mounting Option | SPLIT BOARD LOCK |
| Body Breadth | 0.225inch |
| Body Depth | 0.435inch |
| Body Length | 0.375inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | NOT SPECIFIED |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.429mm |
| Rated Current (Signal) | 3.2A |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 10 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the split board-lock (E.L.P.) feature on the TFM-105-32-L-D-LC benefit SMT assembly?
The split board-lock anchor legs press into the PCB to hold the 10-position connector in place during automated pick-and-place and reflow soldering at peak temperatures up to 260°C, preventing the part from shifting and ensuring the 0.050-inch pitch contacts land precisely on their pads.
What is the contact pitch and row count of the TFM-105-32-L-D-LC, and what connector does it mate with?
The TFM-105-32-L-D-LC is a 10-position dual-row male terminal strip on a 0.050-inch (1.27 mm) pitch that mates with corresponding SAMTEC SFM or SFW series dual-row socket strips, forming a reliable board-to-board stacking interface rated for hundreds of mating cycles.
In which industrial applications is the TFM-105-32-L-D-LC terminal strip particularly well suited?
Its 10-position layout at 0.050-inch pitch and vertical SMT orientation make the TFM-105-32-L-D-LC ideal for modular industrial control cards, PLC expansion modules, and small embedded daughter boards where signal densities require dual-row connectivity within a body footprint of just 0.375 × 0.225 inches.
What termination finish does the TFM-105-32-L-D-LC use, and how does nickel underplating help in harsh environments?
The connector uses tin (Sn) plating over a nickel (Ni) barrier layer on the termination contacts. The nickel diffusion barrier prevents tin-copper intermetallic growth at solder joints over temperature cycles from -55°C to +125°C, maintaining joint integrity in vibration-prone or thermally cycling industrial enclosures.
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