TFM-105-03-SM-D-LC SAMTEC Connector (Other) In Stock
SAMTEC TFM-105-03-SM-D-LC is a high-reliability Tiger Eye terminal strip in a 5-position dual-row surface-mount configuration at 0.050" (1.27 mm) pitch with a low-clearance body profile. Provides 10 contacts for compact SMT board-to-board interconnect with minimal stack height. Available from global distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 10
- Lifecycle
- ACTIVE
- Datasheet
- TFM-105-03-SM-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-105-03-SM-D-LC?
- 5-position dual-row SMT layout at 0.050" (1.27 mm) pitch delivers 10 contacts in a compact footprint for high-density board-to-board signal routing
- Low-clearance (LC) body reduces the connector height above the PCB surface, enabling tighter mezzanine stack heights compared to standard-height Tiger Eye strips
- Tiger Eye contact geometry provides reliable self-wiping action with consistent contact normal force across repeated mating and unmating cycles
What is TFM-105-03-SM-D-LC used for?
The TFM-105-03-SM-D-LC is used in compact mezzanine board stacks, portable industrial instruments, and embedded computing modules where a 10-contact surface-mount connector at 0.050" pitch is required with the lowest possible profile. The low-clearance design enables board-to-board configurations with tightly controlled stack heights, making it suitable for sealed enclosures and slim handheld devices. Its SMT termination is fully compatible with standard automated reflow soldering processes used in high-volume electronics manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-105-03-SM-D-LC datasheet?
TFM-105-03-SM-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-105-03-SM-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does TFM-105-03-SM-D-LC differ from TFM-105-03-F-D-LC in terms of PCB assembly method?
TFM-105-03-SM-D-LC uses surface-mount (SM) termination, while TFM-105-03-F-D-LC uses through-hole (F) termination. The SM variant is placed and reflowed during the standard SMT assembly pass without drilling PCB holes, reducing board fabrication cost and enabling placement on both sides of the PCB at 0.050" (1.27 mm) pitch.
What maximum board-to-board stack height can be achieved using TFM-105-03-SM-D-LC with a matched mating strip?
The low-clearance (LC) body of TFM-105-03-SM-D-LC is designed for tight mezzanine stacking. When paired with a matched low-clearance mating strip, the total board-to-board stack height can be kept below 4 mm to 5 mm, supporting slim multi-board module designs where overall assembly thickness must fit within tight mechanical envelopes.
Which signal interfaces are well suited to the 10-contact layout of TFM-105-03-SM-D-LC at 0.050" pitch?
The 10-contact dual-row layout covers common embedded interfaces including SPI (4 signals plus power and ground), I2C with interrupt lines (4 signals), UART with handshaking (4 signals), and parallel sensor buses with 8 data lines plus control signals. At 0.050" pitch the connector occupies approximately 6.35 mm of board length, fitting neatly between other SMD components on densely populated PCBs.
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