TFM-105-01-L-D-LC SAMTEC Connector (Other) In Stock
TFM-105-01-L-D-LC is a 10-position dual-row low-profile board connector receptacle by SAMTEC with split board lock mounting and 15µin gold over 50µin nickel mating contacts. Key specs: body dimensions 0.375 x 0.225 x 0.22 inch, RoHS compliant, tin with nickel barrier termination. Suited for high-cycle board-to-board signal interconnects in compact electronics.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 10
- Lifecycle
- ACTIVE
- Datasheet
- TFM-105-01-L-D-LC Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 15µin gold over 50µin nickel mating contacts ensure low contact resistance and corrosion resistance across high cycle counts
- Split board lock mounting mechanism provides secure mechanical retention on PCB without additional hardware
- Compact dual-row 10-position body (0.375 x 0.225 x 0.22 inch) minimizes footprint in space-constrained board interconnect designs
Applications
The TFM-105-01-L-D-LC is ideal for low-profile board-to-board signal connections in portable medical devices, industrial sensor modules, and compact embedded computing platforms where reliable mating and minimal PCB height are required. Its split board lock provides mechanical stability during vibration and repeated mating cycles without requiring separate locking hardware. The 10-position dual-row layout efficiently routes multiple signal lines through a single compact footprint of 0.375 x 0.225 inch.
Specifications
| YTEOL | 9.15 |
| Additional Feature | ROHS COMPLIANT |
| Board Mounting Option | SPLIT BOARD LOCK |
| Body Breadth | 0.225inch |
| Body Depth | 0.22inch |
| Body Length | 0.375inch |
| Body/Shell Style | RECEPTACLE |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (15) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 10u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 5A |
| Reference Standard | UL, CSA |
| Terminal Pitch | 1.27mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 10 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | USA, Vietnam |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the split board lock on the TFM-105-01-L-D-LC retain the connector during vibration or mechanical stress?
The split board lock on the TFM-105-01-L-D-LC grips the PCB edge or through-hole locks to provide mechanical retention that resists dislodgement under vibration and repeated plug cycles. This eliminates the need for separate retaining clips or adhesive, reducing assembly cost. The compact body measuring 0.375 x 0.225 x 0.22 inch keeps the vertical profile low while the board lock provides the pull-out resistance required for industrial and portable applications.
What contact plating does the TFM-105-01-L-D-LC use, and how many mating cycles can it support reliably?
The TFM-105-01-L-D-LC uses 15 microinches of gold over 50 microinches of nickel on its mating contacts. Gold at 15µin thickness provides corrosion resistance and stable low contact resistance suited for hundreds to thousands of mating cycles, which is typical of SAMTEC board connectors in this class. The nickel underlayer acts as a diffusion barrier to protect the phosphor bronze base material from gold wear-through in high-cycle scenarios.
In which industries is the TFM-105-01-L-D-LC most commonly specified, and what board-to-board pitch does it use?
The TFM-105-01-L-D-LC is commonly specified in portable medical diagnostics, industrial sensor arrays, and compact embedded computing modules where a 10-position dual-row board connector with a low 0.22 inch mated height is needed. Its 0.050 inch (1.27mm) pitch design supports high-density signal routing, and the RoHS-compliant tin termination with nickel barrier ensures compatibility with lead-free solder processes used in modern electronics manufacturing.
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