TFC-149-02-LM-D-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TFC-149-02-LM-D-K-TR is a 98-position Tiger Eye dual-row low-profile terminal strip with 0.050 inch (1.27 mm) pitch, supplied in tape-and-reel format for SMT assembly. It offers gold-plated contacts and a keyed dual-row layout carrying 98 signals in a compact footprint. Available from stock worldwide for high-density module interconnects and backplane interfaces.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 98
- Lifecycle
- ACTIVE
- Datasheet
- TFC-149-02-LM-D-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 98 positions at 0.050 inch (1.27 mm) dual-row pitch providing one of the highest signal densities available in a Tiger Eye terminal strip format
- Low-profile mounting (LM) variant reducing connector height above board enabling tighter mezzanine stack heights in space-constrained assemblies
- Keyed (-K) housing preventing incorrect mating orientation across 98 positions to eliminate wiring errors in complex multi-signal interfaces
- Tape-and-reel (-TR) packaging enabling fully automated SMT pick-and-place assembly at high production volumes with standard 16 mm carrier tape
Applications
The TFC-149-02-LM-D-K-TR is used in high-density backplane and mezzanine card interfaces within network switches, server blades, and FPGA accelerator cards where 98 signals must cross a card edge within a minimal 1.27 mm pitch footprint. The keyed housing prevents mis-mating in complex multi-card chassis assemblies where dozens of boards are inserted during field maintenance. Its tape-and-reel packaging supports automated SMT reflow assembly at production volumes exceeding 10,000 units per month with consistent placement accuracy.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Why is keying important on the TFC-149-02-LM-D-K-TR given its 98-position dual-row layout?
With 98 contacts on a 1.27 mm pitch, an incorrectly oriented mating would connect all 98 signals to reversed or offset pins, potentially shorting power and ground rails and destroying both boards. The keyed (-K) housing adds a physical polarization feature that allows mating only in the correct orientation, a critical safety measure in high-count connectors used in server backplanes and FPGA accelerator cards where repair costs can exceed $500 per board.
How does the TFC-149-02-LM-D-K-TR tape-and-reel packaging benefit high-volume SMT production?
The -TR tape-and-reel format packages connectors in a 16 mm carrier tape compatible with standard SMT pick-and-place machines, enabling placement rates of 3000 to 8000 components per hour. This eliminates manual handling of 98-pin connectors that are susceptible to bent-contact damage during tray transfer, reducing assembly defect rates and cutting per-unit labor cost by approximately 15 to 30 seconds compared to tube or tray packaging.
What board length is required to mount the TFC-149-02-LM-D-K-TR and how does this compare to a 2.54 mm pitch alternative?
The TFC-149-02-LM-D-K-TR carries 98 positions at 1.27 mm pitch in a dual-row layout, with each row containing 49 contacts spanning approximately 49 × 1.27 mm = 62.2 mm of PCB edge length. An equivalent 98-position single-row 2.54 mm pitch connector would span 98 × 2.54 mm = 249 mm — four times longer, making the TFC-149 the only practical choice for high-density interfaces on module cards smaller than 80 mm.
For a 98-channel FPGA I/O expansion card, when does the low-profile version of TFC-149-02-LM-D-K-TR outperform a standard-height connector?
In a stacked PCB assembly with a fixed total height budget of 6 mm to 8 mm, the low-profile (LM) variant saves 1 mm to 2 mm of vertical clearance compared to a standard-height TFC connector. This extra space accommodates taller decoupling capacitors (up to 4 mm height on 22 µF to 100 µF 0805 MLCCs), passive filters, or additional PCB thickness without exceeding the chassis slot height limit in 1U to 2U rackmount server enclosures.
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