TFC-137-02-L-D-A-K-TR SAMTEC Connector (Other) In Stock
TFC-137-02-L-D-A-K-TR is a SAMTEC Tiger Eye cost-effective terminal strip with 74 positions in a dual-row layout at 0.050" (1.27 mm) pitch for high-density SMD board-to-board interconnects. It features a low-profile horizontal (L) mounting orientation with tape-and-reel packaging for automated pick-and-place assembly. Available globally from SAMTEC authorized distributors for prototyping and production volume orders.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- TFC-137-02-L-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 74-position dual-row layout at 0.050" (1.27 mm) pitch provides very high signal density in a compact horizontal SMD footprint
- Tiger Eye dual-beam friction-mate contacts ensure consistent electrical connection over repeated mating cycles without mechanical latches
- Tape-and-reel (TR) packaging enables high-throughput automated SMD pick-and-place assembly for volume production efficiency
Applications
TFC-137-02-L-D-A-K-TR is used in high-density board-to-board and mezzanine interconnects in FPGA carrier boards, network interface modules, and embedded computing systems where 74 signals must cross a compact 0.050" pitch interface. Its horizontal low-profile mounting suits applications with strict height budgets above the PCB, such as blade servers and communication line cards. The tape-and-reel format supports high-volume automated assembly in telecom and industrial electronics production.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does TFC-137-02-L-D-A-K-TR's 0.050" pitch compare to 0.100" pitch terminal strips for high-density designs?
TFC-137-02-L-D-A-K-TR uses a 0.050" (1.27 mm) pitch, placing contacts at half the spacing of standard 0.100" (2.54 mm) pitch connectors. Its 74-position dual-row layout fits within approximately 47 mm of PCB edge, compared to roughly 94 mm needed for an equivalent 0.100" pitch connector carrying the same 74 signals. This halved pitch is critical in FPGA mezzanine boards and high-density data acquisition modules where PCB real estate is scarce.
What does the low-profile horizontal mounting orientation of TFC-137-02-L-D-A-K-TR mean for board stack height?
TFC-137-02-L-D-A-K-TR uses a horizontal (L) low-profile mounting style, which means the connector body lies flat along the PCB rather than protruding vertically. This reduces the overall height of the board-to-board assembly, which is essential in blade server slots, compact embedded modules, and PCIe mezzanine cards where the gap between board layers may be limited to a few millimeters. The 0.050" (1.27 mm) pitch dual-row design maintains 74-signal capacity within this low-profile form.
How reliable are SAMTEC Tiger Eye contacts in TFC-137-02-L-D-A-K-TR over many mating cycles?
SAMTEC's Tiger Eye contact system in TFC-137-02-L-D-A-K-TR uses dual independent contact beams that each apply normal force against the mating contact, maintaining stable electrical connection even after hundreds of insertion cycles. The dual-beam design compensates for minor misalignment at the 0.050" (1.27 mm) pitch interface and resists contact resistance increase caused by wear or vibration. This makes Tiger Eye connectors suitable for field-replaceable modules that are swapped multiple times during a product's service life.
What procurement and assembly benefits does the tape-and-reel format of TFC-137-02-L-D-A-K-TR provide?
TFC-137-02-L-D-A-K-TR comes in tape-and-reel (TR) packaging, which is compatible with standard SMD pick-and-place machines and enables high-speed automated placement of the 74-position dual-row connector at 0.050" (1.27 mm) pitch. Tape-and-reel format reduces per-unit handling time versus tray or bulk packaging and minimizes contamination and electrostatic damage during feeding to the placement machine. For production runs of thousands of boards, this format lowers assembly labor cost and improves placement repeatability.
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