TFC-137-02-F-D-A-K-TR SAMTEC Connector (Other) In Stock

SAMTEC TFC-137-02-F-D-A-K-TR is a 74-position Tiger Eye cost-effective dual-row terminal strip with 0.050-inch pitch, designed for high-density PCB signal interconnects. Available in tape-and-reel packaging with worldwide shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TFC-137-02-F-D-A-K-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
74
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 74-position dual-row layout at 0.050-inch (1.27 mm) pitch for high-density signal interconnect in compact PCB designs
  • Tiger Eye contact technology provides low-insertion-force mating with reliable 0.050-inch pitch engagement across all 74 positions
  • Cost-effective terminal strip with tape-and-reel (TR) packaging for automated SMT assembly lines

Applications

The TFC-137-02-F-D-A-K-TR is designed for high-density board-to-board and board-to-cable signal routing in computing, telecommunications, and instrumentation equipment. Its 74-position dual-row 0.050-inch pitch layout suits compact embedded systems and backplane modules where maximizing signal density within a small footprint is essential. The tape-and-reel format supports automated pick-and-place assembly for high-volume production runs.

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)

Datasheet

TFC-137-02-F-D-A-K-TR Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What pin count and pitch does the TFC-137-02-F-D-A-K-TR offer for high-density interconnect applications?

The TFC-137-02-F-D-A-K-TR features 74 positions in a dual-row arrangement with a 0.050-inch (1.27 mm) pitch. This high-density layout allows designers to route 74 signals within a minimal PCB footprint, making it ideal for compact embedded systems and data-intensive backplane applications.

In what assembly format does the SAMTEC TFC-137-02-F-D-A-K-TR ship, and what production volumes does it support?

The -TR suffix designates tape-and-reel packaging, enabling automated SMT pick-and-place assembly for medium-to-high production volumes. Each reel holds multiple units configured for 0.050-inch pitch dual-row placement, reducing manual handling and improving throughput on modern SMT lines handling 74-position connectors.

When would TFC-137-02-F-D-A-K-TR be preferred over wider-pitch alternatives for signal routing boards?

The 0.050-inch pitch of the TFC-137-02-F-D-A-K-TR allows 74 signal connections in roughly half the board space required by a 0.100-inch pitch equivalent. This trade-off favors the TFC-137 when PCB area is constrained and signal density requirements exceed what a 37-position or lower-count 0.100-inch connector can achieve within the same footprint.

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About SAMTEC

SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
Contact for Price
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pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Response time is incredible — usually under 4 hours. They understand that production lines can't wait.

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James Wright
Supply Chain Director, CircuitPro Ltd, UK