TFC-137-02-F-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TFC-137-02-F-D-A-K-TR is a 74-position Tiger Eye cost-effective dual-row terminal strip with 0.050-inch pitch, designed for high-density PCB signal interconnects. Available in tape-and-reel packaging with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- TFC-137-02-F-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 74-position dual-row layout at 0.050-inch (1.27 mm) pitch for high-density signal interconnect in compact PCB designs
- Tiger Eye contact technology provides low-insertion-force mating with reliable 0.050-inch pitch engagement across all 74 positions
- Cost-effective terminal strip with tape-and-reel (TR) packaging for automated SMT assembly lines
Applications
The TFC-137-02-F-D-A-K-TR is designed for high-density board-to-board and board-to-cable signal routing in computing, telecommunications, and instrumentation equipment. Its 74-position dual-row 0.050-inch pitch layout suits compact embedded systems and backplane modules where maximizing signal density within a small footprint is essential. The tape-and-reel format supports automated pick-and-place assembly for high-volume production runs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pin count and pitch does the TFC-137-02-F-D-A-K-TR offer for high-density interconnect applications?
The TFC-137-02-F-D-A-K-TR features 74 positions in a dual-row arrangement with a 0.050-inch (1.27 mm) pitch. This high-density layout allows designers to route 74 signals within a minimal PCB footprint, making it ideal for compact embedded systems and data-intensive backplane applications.
In what assembly format does the SAMTEC TFC-137-02-F-D-A-K-TR ship, and what production volumes does it support?
The -TR suffix designates tape-and-reel packaging, enabling automated SMT pick-and-place assembly for medium-to-high production volumes. Each reel holds multiple units configured for 0.050-inch pitch dual-row placement, reducing manual handling and improving throughput on modern SMT lines handling 74-position connectors.
When would TFC-137-02-F-D-A-K-TR be preferred over wider-pitch alternatives for signal routing boards?
The 0.050-inch pitch of the TFC-137-02-F-D-A-K-TR allows 74 signal connections in roughly half the board space required by a 0.100-inch pitch equivalent. This trade-off favors the TFC-137 when PCB area is constrained and signal density requirements exceed what a 37-position or lower-count 0.100-inch connector can achieve within the same footprint.
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