TFC-129-02-LM-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC TFC-129-02-LM-D-A-K is a 58-position Tiger Eye cost-effective terminal strip with 0.050" pitch, dual-row low-profile through-hole mounting for high-density PCB signal interconnect. Features gold-plated contacts for low resistance and long-term reliability in demanding applications. Available globally through authorized SAMTEC distributors.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 58
- Lifecycle
- ACTIVE
- Datasheet
- TFC-129-02-LM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 58-position dual-row terminal strip at 0.050" (1.27 mm) pitch delivering high signal density within a compact PCB footprint
- Tiger Eye contact technology providing high normal force and contact resistance consistently below 20 milliohms across thousands of mating cycles
- Low-profile through-hole mounting (LM suffix) combining minimal above-board height with robust mechanical attachment for vibration-resistant installations
- Gold-plated contacts ensuring corrosion resistance and stable electrical performance in industrial, telecom, and embedded computing environments
Applications
The TFC-129-02-LM-D-A-K is suited for high-density interconnect in backplane assemblies, mezzanine card interfaces, and industrial embedded computing platforms where 58 signals must pass through a single 1.27 mm pitch connector with a low profile. It is commonly deployed in telecommunications infrastructure, defense electronics, and data acquisition systems that require reliable through-hole mounting with minimal board-height impact. The cost-effective Tiger Eye design also supports medium-to-high-volume production applications in industrial automation and networking equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the LM suffix on the TFC-129-02-LM-D-A-K indicate about its mounting configuration?
The LM suffix indicates a low-profile through-hole mounting variant. The low-profile designation means the connector body sits close to the PCB surface, typically keeping the above-board height to under 3 mm, which is important in multi-board stacks or enclosures with tight vertical constraints. The through-hole mounting provides a mechanically strong solder joint that resists vibration and shock loads, making this combination valuable in industrial and defense applications where both height and ruggedness are design requirements.
How many signals can the TFC-129-02-LM-D-A-K route and at what contact pitch?
The TFC-129-02-LM-D-A-K routes 58 signals in a dual-row arrangement at a 0.050" (1.27 mm) pitch. This contact density allows designers to consolidate 58 signal connections into a single connector rather than using multiple lower-count components, which simplifies board layout, reduces BOM complexity, and frees up PCB area for other circuits. It is well-matched to embedded CPU boards, FPGA modules, and backplane daughter-card interfaces in telecom and industrial systems.
How does the gold plating on TFC-129-02-LM-D-A-K contacts contribute to long-term signal integrity?
Gold-plated contacts on the TFC-129-02-LM-D-A-K resist oxidation and corrosion far better than tin-plated alternatives, which can form resistive oxide layers over time especially in humid or thermally cycled environments. Gold plating maintains contact resistance below 20 milliohms throughout the connector's service life, ensuring signal integrity across all 58 positions is preserved from initial installation to end-of-life. This makes the connector a reliable choice for mission-critical systems in industrial automation and telecommunications infrastructure.
When would an engineer prefer the 58-position TFC-129-02-LM-D-A-K over the 52-position TFC-126 variant?
An engineer would select the 58-position TFC-129-02-LM-D-A-K when a design needs 53 to 58 signal connections through a single connector, since forcing 58 signals through a 52-position part is not possible and using two smaller connectors would consume more board space and add mechanical complexity. The 6 additional positions also provide spare contacts that can serve as ground returns, shield connections, or future signal expansion without requiring a PCB redesign, which is a common practice in scalable backplane and mezzanine card architectures.
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