TFC-103-02-F-D-A-K SAMTEC Connector (Other) In Stock

SAMTEC TFC-103-02-F-D-A-K is a 6-position Tiger Eye Cost-Effective Terminal Strip with 0.050" (1.27 mm) pitch, male tin-over-nickel barrier termination contacts, and JESD-609 e3 RoHS compliance for compact dual-row PCB board-to-board signal connections.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TFC-103-02-F-D-A-KOther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
6
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 6-position dual-row male connector at 0.050" (1.27 mm) pitch with tin (Sn) over nickel (Ni) barrier termination for improved solder joint reliability and corrosion resistance
  • Tiger Eye dual-beam contact design delivers consistent mating force and contact resistance below 20 mΩ in a very compact 6-circuit footprint
  • JESD-609 e3 RoHS-compliant construction meets lead-free manufacturing requirements for global product compliance

Applications

The TFC-103-02-F-D-A-K is deployed in ultra-compact PCB assemblies, sensor breakout boards, and small IoT module interconnects where only 6 signal circuits need to pass through a minimal connector body at 1.27 mm pitch. Its small 6-position size makes it ideal for power-plus-signal dual-row connections in embedded modules with extremely tight board space constraints. The tin-over-nickel termination supports reliable lead-free soldering in consumer electronics and industrial miniature sensor products.

Specifications

YTEOL9.4
Connector TypeBOARD CONNECTOR
Contact Finish TerminationTin (Sn) - with Nickel (Ni) barrier
Contact GenderMALE
DIN ConformanceNO
Filter FeatureNO
IEC ConformanceNO
JESD-609 Codee3
MIL ConformanceNO
Mixed ContactsNO
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number of Rows Loaded2
OptionGENERAL PURPOSE
Rated Current (Signal)3.1A
Terminal Pitch1.27mm
Termination TypeSURFACE MOUNT
Total Number of Contacts6
UL Flammability Code94V-0
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40

Datasheet

TFC-103-02-F-D-A-K Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

Why does the TFC-103-02-F-D-A-K use a tin-over-nickel termination rather than plain tin, and what advantage does this provide?

The TFC-103-02-F-D-A-K uses a tin (Sn) over nickel (Ni) barrier termination, where the nickel underplate acts as a diffusion barrier between the copper contact alloy and the tin outer layer. This prevents tin whisker growth and tin-copper intermetallic formation that can degrade solder joint reliability at temperatures above 100°C. The nickel barrier also extends the shelf life of the 6-position connector by preventing base-metal migration, ensuring consistent lead-free solderability even after 12 months of storage at standard conditions.

For a sensor breakout board needing only 6 signal connections at 1.27 mm pitch, what board area does the TFC-103-02-F-D-A-K occupy?

The TFC-103-02-F-D-A-K in a 6-position dual-row 1.27 mm pitch configuration occupies a PCB footprint of approximately 5 mm in length (3 contacts per row at 1.27 mm spacing) and under 6 mm in width, consuming less than 30 mm² of board area. This is significantly smaller than a 6-position 2.54 mm pitch alternative, which would require roughly 10 mm of length. The compact footprint is critical for coin-cell-sized sensor modules and wearable-electronics PCBs where board area is limited to a few hundred square millimeters.

What JESD-609 compliance level does the TFC-103-02-F-D-A-K carry, and why is this relevant for CE-marked product export?

The TFC-103-02-F-D-A-K carries JESD-609 code e3, indicating it is a lead-free (Pb-free) component with a moisture sensitivity level compatible with standard IPC/JEDEC reflow profiles. For CE-marked products exported to the European Union, e3-coded components satisfy the RoHS Directive 2011/65/EU requirements for absence of lead in homogeneous materials below 0.1 percent by weight. Using e3-compliant connectors across the BOM simplifies the Declaration of Conformity process and avoids RoHS annex exemption paperwork, reducing compliance overhead for small-quantity product launches.

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About SAMTEC

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AvailabilityIn Stock
Reference Price (USD)
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pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

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