TDA3LXBBABFQ1 Texas Instruments Integrated Circuit (BGA) In Stock
TDA3LXBBABFQ1 is a Texas Instruments integrated circuit for electronic designs. Key specs include 367 pins, FBGA, and datasheet-backed parameters. From inquiry quote with in stock worldwide shipping support.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 367
- Lifecycle
- ACTIVE
- Datasheet
- TDA3LXBBABFQ1 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TDA3LXBBABFQ1?
- 367 pins design reference for integrated circuit selection
- FBGA package information for footprint planning
- Datasheet-backed integrated circuit from Texas Instruments
- RFQ-ready sourcing detail with worldwide shipping support
What is TDA3LXBBABFQ1 used for?
Used in embedded control, industrial electronics, signal-chain, timing, power, or interface designs depending on the target circuit. It is suitable for prototypes, repairs, and production builds where 367 pins, datasheet traceability, and worldwide sourcing support matter.
What are the specifications of TDA3LXBBABFQ1?
| Pbfree Code | Yes |
| Date Of Intro | 2017-09-28 |
| YTEOL | 15 |
| JESD-30 Code | S-PBGA-B367 |
| JESD-609 Code | e1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA367,22X22,25 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, FINE PITCH |
| Peak Reflow Temperature (Cel) | 250 |
| Screening Level | AEC-Q100 |
| Supply Voltage-Max | 1.11V |
| Supply Voltage-Min | 1.02V |
| Supply Voltage-Nom | 1.06V |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.65mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | SoC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 3A991.A.1 |
| HTS Code | 8542.31.00.35 |
Where can I find the TDA3LXBBABFQ1 datasheet?
TDA3LXBBABFQ1 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for TDA3LXBBABFQ1?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What PCB and inspection challenges come with the BGA package of TDA3LXBBABFQ1?
The device uses 367 pins in a fine-pitch grid array, so PCB escape routing, controlled assembly, and post-reflow inspection require suitable high-density manufacturing capability.
How should the documented peak reflow temperature guide assembly planning?
The listed peak is 250°C, but the board assembler must still follow the complete temperature profile, moisture handling, and package-specific process limits from the documentation.
For qualified replacement sourcing, which package and compliance points must match?
A candidate must preserve the function and mapping across all 367 pins, match the FBGA mechanical outline, and satisfy the required Pb-free and traceability criteria.
Related Guides
STM32H725IGT3 Selection Guide: Memory, Package, Temperature, and Supply
Choose the right STM32H725 variant by comparing Flash, package, pin count, temperature grade, connectivity, and production requirements.
Aug 1, 2026
STM32H725IGT3 High-Performance MCU Design Guide
Design STM32H725IGT3 systems for reliable 550 MHz operation with practical power, clock, cache, DMA, PCB, ADC, and recovery guidance.
Jul 31, 2026
150141VS73100 Violet SMD LED Selection Guide: Color, Drive, and Sourcing
Select the 150141VS73100 by wavelength, brightness, drive current, 3528 fit, reliability, and traceable sourcing requirements.
Jul 31, 2026
STEF05SGR 5 V eFuse Protection Design Guide
Design a reliable 5 V STEF05SGR eFuse stage with current-limit math, capacitor sizing, thermal analysis, fault recovery, and PCB layout guidance.
Jul 30, 2026
Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
More from Texas Instruments
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“Response time is incredible — usually under 4 hours. They understand that production lines can't wait.”
You May Also Like
ACS770ECB-200U-PFF-T
Allegro Microsystems
Integrated Circuit
ACS770KCB-150U-PFF-T
Allegro Microsystems
Integrated Circuit
MC33901WEF
NXP
Integrated Circuit
MC7808BDTRKG
ON Semiconductor
Integrated Circuit
PA94EC
Apex Microtechnology
Integrated Circuit
AP7315-28SR-7
Diodes Inc.
Integrated Circuit
74HCT245D
Nexperia
Integrated Circuit
CY62256VNLL-70ZXCT
Cypress Semiconductor
Integrated Circuit
EPM7032AETC44-4N
Intel
Integrated Circuit
EPM3512AQC208-10N
Intel
Integrated Circuit
EPM3256ATC144-7N
Intel
Integrated Circuit
EPM3256AQC208-7N
Intel
Integrated Circuit
EPM3256AQC208-10N
Intel
Integrated Circuit
EPM3128ATC100-7N
Intel
Integrated Circuit
EPM1270F256C4N
Intel
Integrated Circuit
EPF8282ATC100-4N
Intel
Integrated Circuit
EPF6016QC208-2N
Intel
Integrated Circuit
EPF6016ATC144-3N
Intel
Integrated Circuit
EPF10K30ATC144-3N
Intel
Integrated Circuit
EPC2TI32N
Intel
Integrated Circuit
EPC2LC20
Intel
Integrated Circuit
EP3SL150F1152C4N
Intel
Integrated Circuit
EP2SGX60DF780C5N
Intel
Integrated Circuit
EP2SGX60CF780C5N
Intel
Integrated Circuit