TC7WZ126FK Toshiba Integrated Circuit (Small Outline Packages) In Stock

Toshiba TC7WZ126FK is a dual unidirectional bus buffer in the LVC/LCX/Z logic family, housed in an 8-pin SOT-765 package. Offers 13 ns propagation delay at 15 pF load with 32 mA output drive capability and enable-high control for 3-state bus sharing. Competitively priced and available from global distributors with reliable worldwide shipping.

ACTIVEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
TC7WZ126FKSmall Outline Packages
Quick Facts
Manufacturer
Toshiba
Package
Small Outline Packages
Pin Count
8
Lifecycle
ACTIVE
Category
Integrated Circuit
Temp Range
-40.0°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • Dual independent bus buffers with active-high enable control support flexible 3-state bus sharing in multi-master designs
  • Fast 13 ns propagation delay at 15 pF load with 32 mA output drive suits high-speed logic level translation and bus buffering
  • Ultra-compact 8-pin SOT-765 package occupies minimal PCB area for space-constrained mobile and wearable electronics

Applications

The TC7WZ126FK is used for bus isolation and signal buffering in microcontroller I/O expansion circuits, UART level translation, and SPI bus fan-out applications operating from 1.65 V to 5.5 V supplies. Its dual-channel 3-state architecture allows two independent bus segments to share a common data line with enable-high control, preventing bus contention in multi-device systems. The tiny SOT-765 package makes it ideal for handheld devices, IoT sensor nodes, and compact embedded modules where board space is limited.

Specifications

YTEOL6
Control TypeENABLE HIGH
Count DirectionUNIDIRECTIONAL
FamilyLVC/LCX/Z
JESD-30 CodeR-PDSO-G8
Load Capacitance (CL)50pF
Logic IC TypeBUS DRIVER
Max I(ol)0.024A
Number of Bits1
Number of Functions2
Number of Ports2
Output Characteristics3-STATE
Output PolarityTRUE
Package Body MaterialPLASTIC/EPOXY
Package ShapeRECTANGULAR
Package StyleSMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)NOT SPECIFIED
Power Supply Current-Max (ICC)50mA
Prop. Delay@Nom-Sup6ns
Propagation Delay (tpd)11.5ns
Qualification StatusNot Qualified
Screening LevelAEC-Q100
Supply Voltage-Max (Vsup)5.5V
Supply Voltage-Min (Vsup)1.65V
Supply Voltage-Nom (Vsup)1.8V
Surface MountYES
TechnologyCMOS
Temperature GradeINDUSTRIAL
Terminal FormGULL WING
Terminal Pitch0.5mm
Terminal PositionDUAL
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
PackageSmall Outline Packages

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
HTS Code8542.39.00.60

Datasheet

TC7WZ126FK Datasheet Download

Official datasheet from Toshiba

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What is the propagation delay and output drive current of the TC7WZ126FK at a typical capacitive load?

The TC7WZ126FK achieves a propagation delay of 13 ns at a 15 pF load with an output drive capability of 32 mA. At the higher specified load of 50 pF, the propagation delay increases slightly, which is important to account for when timing budgets are tight in multi-drop bus designs operating above 50 MHz.

How does the TC7WZ126FK's 3-state enable control prevent bus contention in multi-master SPI or I2C designs?

Each of the 2 buffer channels in the TC7WZ126FK has an independent active-high output enable (OE) pin that places the output in a high-impedance state when deasserted. This 3-state control allows system firmware or logic to selectively disconnect one or both buffers from a shared 1.8 V to 3.3 V bus, preventing data collisions between multiple masters on the same signal line.

What space advantage does the TC7WZ126FK's SOT-765 package provide compared to SC-70 or SOT-23 alternatives for dual-buffer functions?

The 8-pin SOT-765 package measures approximately 2.0 mm x 2.1 mm, integrating 2 independent bus buffer channels in a footprint smaller than many single-channel SC-70 or SOT-23-5 devices. Choosing TC7WZ126FK over two discrete single-buffer ICs saves roughly 30-50% PCB area and reduces BOM count by 1 component in mobile, wearable, and IoT designs where every square millimeter matters.

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AvailabilityIn Stock
Reference Price (USD)
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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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