TC58BVG2S0HTAI0 Toshiba Integrated Circuit (Small Outline Packages) In Stock
TC58BVG2S0HTAI0 from Toshiba is a integrated circuit for industrial controls, embedded electronics, maintenance sourcing, and production assemblies. Key specifications include 1A, 25ns, 4294967296bit, 536870912w, TSOP1 package/footprint, supporting reliable selection for OEM maintenance, prototyping, and production BOMs. The TSOP1 format supports standard assembly and sourcing workflows.
- Manufacturer
- Toshiba
- Package
- Small Outline Packages
- Pin Count
- 48
- Lifecycle
- TRANSFERRED
- Datasheet
- TC58BVG2S0HTAI0 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 1A rating/value supports defined circuit selection for this integrated circuit
- 25ns specification provides an additional quantitative design check
- TSOP1 package or footprint supports standard PCB assembly and replacement planning
- 48-pin configuration helps confirm footprint, routing, and connector compatibility
- -40°C to 85°C operating range suits controlled industrial or commercial environments
- Toshiba sourcing identity supports BOM traceability and authorized-equivalent review
Applications
TC58BVG2S0HTAI0 is commonly considered for industrial controls, embedded electronics, maintenance sourcing, and production assemblies where designers need a integrated circuit with 1A, 25ns, 4294967296bit, 536870912w, TSOP1 package/footprint. It is suitable for OEM BOM refresh, maintenance sourcing, prototype builds, and production assemblies that require traceable component selection.
Specifications
| Access Time-Max | 25ns |
| JESD-30 Code | R-PDSO-G48 |
| Memory Density | 4294967296bit |
| Memory IC Type | FLASH |
| Memory Width | 8 |
| Number of Functions | 1 |
| Number of Words | 536870912words |
| Number of Words Code | 512000000 |
| Operating Mode | ASYNCHRONOUS |
| Organization | 512MX8 |
| Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP48,.8,20 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | SERIAL |
| Programming Voltage | 3.3V |
| Standby Current-Max | 0.00005A |
| Supply Current-Max | 0.03mA |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 2.7V |
| Supply Voltage-Nom (Vsup) | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.5mm |
| Terminal Position | DUAL |
| Type | NAND TYPE |
| Write Cycle Time-Max (tWC) | 0.000025ms |
| Write Protection | HARDWARE |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.32.00.51 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which designs are a good fit for TC58BVG2S0HTAI0 when 1A is required?
TC58BVG2S0HTAI0 is a integrated circuit from Toshiba for industrial controls, embedded electronics, maintenance sourcing, and production assemblies. The 1A specification helps engineers confirm electrical margin before adding it to a production BOM.
How should engineers check the footprint before placing TC58BVG2S0HTAI0 on a PCB?
Review the TSOP1 package information together with 48 pins before layout release. That check reduces substitution risk when matching land pattern, assembly process, and approved vendor data.
When would procurement choose TC58BVG2S0HTAI0 instead of a nearby alternate?
Buyers should keep TC58BVG2S0HTAI0 when the approved design depends on 25ns and TSOP1 compatibility. Alternate reviews should verify at least 1 matching electrical rating and footprint constraint.
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