SY89876LMGAlternatives & Equivalent Parts
About SY89876LMG
SY89876LMG is a Integrated Circuit component manufactured by Microchip. It comes in a Quad Flat No-Lead package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | SY89876LMGSource | SY89876LMG-TR |
|---|---|---|
| Manufacturer | Microchip | Microchip |
| Package Type | Quad Flat No-Lead | Quad Flat No-Lead |
| Pin Count | 16 | 16 |
| Temperature Range | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C |
| Price | $4.3000 | $4.2800 |
| Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | ACTIVE |
| Electrical Parameters | ||
| Manufacturer Package Code | VQFN-16 | VQFN-16 |
| Factory Lead Time | 8 Weeks | 8 Weeks |
| YTEOL | 9 | 8 |
| Family | 89876 | 89876 |
| Input Conditioning | DIFFERENTIAL MUX | DIFFERENTIAL MUX |
| JESD-30 Code | S-XQCC-N16 | S-XQCC-N16 |
| JESD-609 Code | e4 | e4 |
| Logic IC Type | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER |
| Number of Functions | 1 | 1 |
| Number of True Outputs | 4 | 4 |
| Package Body Material | UNSPECIFIED | UNSPECIFIED |
| Package Equivalence Code | LCC16,.12SQ,20 | LCC16,.12SQ,20 |
| Package Shape | SQUARE | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Packing Method | TUBE | TR |
| Power Supply Current-Max (ICC) | 100 mA | 100 mA |
| Prop. Delay@Nom-Sup | 0.87 ns | 0.87 ns |
| Propagation Delay (tpd) | 0.87 ns | 0.87 ns |
| Qualification Status | Not Qualified | Not Qualified |
| Same Edge Skew-Max (tskwd) | 0.015 ns | 0.015 ns |
| Supply Voltage-Max (Vsup) | 3.6 V | 3.6 V |
| Supply Voltage-Min (Vsup) | 3 V | 3 V |
| Supply Voltage-Nom (Vsup) | 3.3 V | 3.3 V |
| Surface Mount | YES | YES |
| Temperature Grade | INDUSTRIAL | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | NO LEAD | NO LEAD |
| Terminal Pitch | 0.5 mm | 0.5 mm |
| Terminal Position | QUAD | QUAD |
| fmax-Min | 2000 MHz | 2000 MHz |
| Reach Compliance Code | — | Compliant |
| Peak Reflow Temperature (Cel) | — | 260 |
| Time@Peak Reflow Temperature-Max (s) | — | 40 |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
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Quick Links
Microchip Technology Inc 3.3V LVDS Output Clock Divider/Fanout
Why Look for Alternatives?
Finding alternatives for SY89876LMG is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating SY89876LMG replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to SY89876LMG?
Known equivalents for SY89876LMG include SY89876LMG-TR. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of SY89876LMG?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify SY89876LMG alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.