STMM-113-02-L-D-SM SAMTEC Connector (Other) In Stock
SAMTEC STMM-113-02-L-D-SM is a 26-position dual-row board stacking connector with 0.100" (2.54 mm) pitch in a surface-mount low-profile configuration. Features phosphor bronze contacts with gold over nickel mating finish and tin-nickel termination for reliable board-to-board stacking. RoHS compliant and available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 26
- Lifecycle
- ACTIVE
- Datasheet
- STMM-113-02-L-D-SM Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 26-position dual-row board stacking connector with 0.100" (2.54 mm) pitch and gold (10 microinch) over nickel (50 microinch) mating contacts for low contact resistance
- Phosphor bronze contact material with tin (Sn) over nickel (Ni) barrier termination providing superior spring force and corrosion resistance in stacking applications
- Low-profile (L) surface-mount design with 0.257" body breadth enabling compact board-stack configurations with minimal inter-board spacing
Applications
The STMM-113-02-L-D-SM is designed for board stacking applications in industrial controllers, embedded computing modules, and multi-board system assemblies where 26 dual-row positions at 0.100" pitch provide a reliable board-to-board interface. Its gold-over-nickel contacts support repeated mating cycles during system integration and field servicing, while the low-profile body minimizes inter-board stack height. The surface-mount termination allows reflow processing alongside other SMT components on the carrier board.
Specifications
| Pbfree Code | Yes |
| YTEOL | 8 |
| Body Breadth | 0.257inch |
| Body Depth | 0.19inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD (10) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Material | POLYAMIDE |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.079inch |
| Mating Contact Row Spacing | 0.079inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 2.0066mm |
| Plating Thickness | 10u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 3A |
| Terminal Pitch | 2mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 26 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact finish does STMM-113-02-L-D-SM use for mating, and how many positions does it provide?
The STMM-113-02-L-D-SM uses gold (10 microinch) over nickel (50 microinch) contact finish on the mating surface, providing low contact resistance and reliable electrical performance through multiple insertion cycles. With 26 positions in a dual-row arrangement at 0.100" (2.54 mm) pitch, it supports board stacking applications where consistent contact quality across all 26 pins is essential for signal integrity in industrial and embedded computing systems.
What makes phosphor bronze a suitable contact material for STMM-113-02-L-D-SM in board stacking applications?
Phosphor bronze offers a high elastic modulus and excellent spring-back characteristics, maintaining consistent contact normal force across all 26 pins of STMM-113-02-L-D-SM even after repeated mating cycles. In board stacking applications where the daughter card may be removed and re-inserted multiple times during system integration or maintenance, phosphor bronze contacts retain their geometry better than softer alloys, ensuring reliable 0.100" pitch mating without degradation of the gold over nickel contact surface.
For a two-board stack requiring 26 signal lines, how does the low-profile (L) designation of STMM-113-02-L-D-SM affect the inter-board spacing?
The low-profile (L) designation on STMM-113-02-L-D-SM specifies a reduced body height compared to standard stacking height variants, allowing the two boards to be positioned closer together while maintaining the required 26-position, 0.100" pitch interface. With a body depth of 0.19 inch, this connector is suitable for compact multi-board assemblies in industrial and embedded systems where minimizing total stack height is important for fitting within enclosures or meeting form factor constraints.
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