STMM-113-02-G-D-SM SAMTEC Connector (Other) In Stock
SAMTEC STMM-113-02-G-D-SM is a 26-position dual-row 0.100" pitch SMT board stacking receptacle with 20 micro-inch gold over 50 micro-inch nickel mating contacts and gold termination. It is RoHS compliant and designed for high-cycle board stacking interconnects. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 26
- Lifecycle
- ACTIVE
- Datasheet
- STMM-113-02-G-D-SM Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Dual-row 0.100" pitch SMT receptacle with 20 micro-inch gold mating contacts over 50 micro-inch nickel for low contact resistance and extended mating cycle reliability
- Gold-with-nickel-barrier termination contacts ensure robust solder joint integrity and resistance to intermetallic diffusion in reflow assembly processes
- RoHS compliant construction with 3-week factory lead time supports green manufacturing initiatives and timely procurement for production schedules
Applications
The STMM-113-02-G-D-SM board stacking receptacle is ideal for mezzanine card interconnects in FPGA development systems, network interface cards, and high-availability server blades requiring reliable 0.100" pitch dual-row connectivity. Its gold-plated contacts and SMT body suit modular industrial computers, test and measurement backplanes, and embedded computing platforms where repeated board insertion, high contact cycle counts, and RoHS compliance are mandatory requirements.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 3Weeks |
| YTEOL | 8 |
| Body Breadth | 0.257inch |
| Body Depth | 0.24inch |
| Body Length | 1.267inch |
| Body/Shell Style | RECEPTACLE |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD (20) OVER NICKEL (50) |
| Contact Finish Termination | Gold (Au) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e4 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.079inch |
| Mating Contact Row Spacing | 0.079inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 4.6482mm |
| Plating Thickness | 20u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 3A |
| Reference Standard | UL |
| Terminal Pitch | 2mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 26 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact finish does the STMM-113-02-G-D-SM use, and what reliability benefit does it provide?
Mating contacts carry 20 micro-inches of gold over 50 micro-inches of nickel, while termination contacts use gold with a nickel barrier. This dual-gold finish minimizes contact resistance to sub-milliohm levels, ensuring stable signal transmission through hundreds of board insertion cycles in mezzanine card and stacking applications.
How many positions does the STMM-113-02-G-D-SM provide, and what is its PCB footprint?
The STMM-113-02-G-D-SM offers 26 positions in a dual-row 0.100" (2.54 mm) pitch SMT receptacle format. The body measures 1.267 inches long, 0.257 inches wide, and 0.24 inches deep, giving designers a predictable rectangular keep-out zone for PCB layout in board stacking applications.
Is the STMM-113-02-G-D-SM suitable for automated PCB assembly, and does it meet RoHS requirements?
Yes, it is a surface mount receptacle compatible with standard pick-and-place and reflow soldering processes, and it carries RoHS compliant status with Pb-free materials. The 3-week factory lead time allows it to be scheduled into production runs with reasonable procurement lead times for volume manufacturing.
In which stacking applications does the STMM-113-02-G-D-SM outperform a through-hole board stacking connector?
The SMT design eliminates through-board via drilling, saving PCB layer assignments and routing channels on both sides of the board. For FPGA mezzanine cards and network processor daughter boards with 26 or fewer signals, the STMM-113-02-G-D-SM's 0.100" pitch SMT footprint reduces PCB thickness requirements and lowers assembly cost compared to equivalent through-hole stacking connectors.
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