STMM-105-02-L-D-SM-K-TR SAMTEC Connector (Other) In Stock
Samtec STMM-105-02-L-D-SM-K-TR is a 2.00 mm pitch shrouded dual-row surface-mount board stacking connector with 10 positions, tin-over-nickel contact finish, and square-pin male contact style for reliable PCB-to-PCB mating.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 10
- Lifecycle
- ACTIVE
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 2.00 mm pitch dual-row shrouded design with 10 positions ensures secure board-to-board mating in compact assemblies
- Tin (Sn) over Nickel (Ni) barrier contact finish provides corrosion resistance and reliable electrical continuity
- Surface-mount (SM) termination style with tape-and-reel (TR) packaging enables high-volume automated PCB assembly
Applications
The STMM-105-02-L-D-SM-K-TR is well suited for board stacking applications in industrial control systems, embedded computing modules, and communications equipment where a 2.00 mm pitch dual-row connector is required. Its surface-mount footprint and tape-and-reel packaging make it ideal for automated assembly lines producing high-density PCBs. The shrouded design protects the 10 male contacts during mating cycles and reduces the risk of mis-insertion.
Specifications
| YTEOL | 8 |
| Body Breadth | 0.257inch |
| Body Depth | 0.24inch |
| Body Length | 0.638inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| Filter Feature | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| Mating Contact Pitch | 0.079inch |
| Mating Contact Row Spacing | 0.079inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 4.66mm |
| Plating Thickness | 10u inch |
| Polarization Key | POLARIZATION NOTCH |
| Rated Current (Signal) | 3A |
| Reference Standard | UL |
| Terminal Pitch | 2mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 10 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | France, Malaysia |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for STMM-105-02-L-D-SM-K-TR:
Board Connector, 10 Contact(s), 2 Row(s), Male, Straight, 0.078 inch Pitch, Surface Mount Terminal, Black Insulator
Board Connector, 10 Contact(s), 2 Row(s), Male, Straight, 0.078 inch Pitch, Surface Mount Terminal, Black Insulator
Board Connector, 10 Contact(s), 2 Row(s), Male, Straight, 0.078 inch Pitch, Surface Mount Terminal, Black Insulator
Board Connector, 12 Contact(s), 2 Row(s), Male, Straight, 0.078 inch Pitch, Surface Mount Terminal, Black Insulator
Board Connector, 16 Contact(s), 2 Row(s), Male, Straight, 0.078 inch Pitch, Surface Mount Terminal, Black Insulator
Frequently Asked Questions
What pitch and row configuration does the STMM-105-02-L-D-SM-K-TR use?
The STMM-105-02-L-D-SM-K-TR uses a 2.00 mm pitch dual-row configuration with 10 total positions (5 per row), making it suitable for compact board stacking where limited PCB real estate demands a small but reliable interconnect solution.
Which PCB assembly processes are compatible with this Samtec connector?
This connector features a surface-mount (SM) termination style and is supplied in tape-and-reel (TR) packaging, making it fully compatible with automated pick-and-place reflow soldering processes commonly used in high-volume PCB manufacturing with placement accuracies of ±0.05 mm.
How does the Ni barrier under the Sn contact finish benefit long-term connector reliability?
The Nickel (Ni) barrier beneath the Tin (Sn) finish acts as a diffusion layer that inhibits intermetallic compound growth, maintaining contact resistance below typical thresholds of 20 mΩ over thousands of mating cycles and across temperature excursions from -55°C to +125°C.
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