STM32WB55RGV7TRAlternatives & Equivalent Parts
About STM32WB55RGV7TR
STM32WB55RGV7TR is a Integrated Circuit component manufactured by STMicroelectronics. It comes in a Quad Flat No-Lead package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
Need pricing on these alternatives?
Get one quote covering all 9 alternatives for STM32WB55RGV7TR — response within 24 hours.
Specification Comparison
| Parameter | STM32WB55RGV7TRSource | STM32L552ZCT6Q | STM32G071RBT6 | BD677 | LDEDB3100KA0N00 | STM32WB55RGV7 | STM32WB55RGV6 | STM32WB55VGY6TR | STM32WB55VEY6TR | STM32WB55VYY6TR |
|---|---|---|---|---|---|---|---|---|---|---|
| Manufacturer | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | Kemet | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package Type | Quad Flat No-Lead | Quad Flat Packages | Quad Flat Packages | Transistor Outline, Vertical | Capacitor Chip Non-polarised | Quad Flat No-Lead | Quad Flat No-Lead | BGA | Other | Other |
| Pin Count | 69 | 144 | 64 | 3 | 2 | 69 | 69 | 100 | 100 | 100 |
| Temperature Range | -40.0°C ~ 105.0°C | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C | ~ 150.0°C | — | — | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C |
| Price | $4.9354 | $6.4398 | $1.6889 | $0.1198 | — | $4.6513 | $3.5910 | $3.9540 | $4.0008 | $4.3118 |
| Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | ACTIVE | ACTIVE | ACTIVE | — | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE |
| Electrical Parameters | ||||||||||
| Factory Lead Time | 13 Weeks | 12 Weeks | — | 14 Weeks | — | 13 Weeks | — | 13 Weeks | 13 Weeks | 13 Weeks |
| Date Of Intro | 2018-10-08 | 2019-12-23 | — | — | — | — | — | 2018-10-08 | 2018-10-08 | 2020-07-02 |
| YTEOL | 9 | 9 | 9 | 9 | — | 9 | 9 | 9 | 9 | 9 |
| JESD-30 Code | S-XQCC-N68 | S-PQFP-G144 | S-PQFP-G64 | R-PSFM-T3 | — | — | S-XQCC-N68 | R-PBGA-B100 | R-PBGA-B100 | R-PBGA-B100 |
| Package Body Material | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | — | — | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package Equivalence Code | LCC68,.31SQ,16 | QFP144,.87SQ,20 | QFP64,.47SQ,20 | — | — | — | LCC68,.31SQ,16 | BGA100,10X10,16 | BGA100,10X10,16 | BGA100,10X10,16 |
| Package Shape | SQUARE | SQUARE | SQUARE | RECTANGULAR | — | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLANGE MOUNT | — | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Supply Voltage-Max | 3.6 V | 3.6 V | 3.6 V | — | — | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Supply Voltage-Min | 3.3 V | 3 V | 1.8 V | — | — | 1.71 V | 1.8 V | 3.3 V | 3.3 V | 3.3 V |
| Supply Voltage-Nom | 3.3 V | 3 V | 1.8 V | — | — | 3 V | 1.8 V | 3.3 V | 3.3 V | 3.3 V |
| Surface Mount | YES | YES | YES | NO | — | YES | YES | YES | YES | YES |
| Technology | CMOS | CMOS | CMOS | — | — | — | CMOS | CMOS | CMOS | CMOS |
| Temperature Grade | INDUSTRIAL | — | — | — | — | — | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal Form | NO LEAD | GULL WING | GULL WING | THROUGH-HOLE | — | NO LEAD | NO LEAD | BALL | BALL | BALL |
| Terminal Pitch | 0.4 mm | 0.5 mm | 0.5 mm | — | — | 0.4 mm | 0.4 mm | 0.4 mm | 0.4 mm | 0.4 mm |
| Terminal Position | QUAD | QUAD | QUAD | SINGLE | — | QUAD | QUAD | BOTTOM | BOTTOM | BOTTOM |
| uPs/uCs/Peripheral ICs Type | RFSoC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | — | — | RFSoC | RFSoC | RFSoC | RFSoC | RFSoC |
| Has ADC | — | YES | YES | — | — | — | — | — | — | — |
| Bit Size | — | 32 | 32 | — | — | — | — | — | — | — |
| Boundary Scan | — | YES | NO | — | — | — | — | — | — | — |
| CPU Family | — | CORTEX-M33 | Cortex-M0+ | — | — | — | — | — | — | — |
| Clock Frequency-Max | — | 48 MHz | 48 MHz | — | — | — | — | — | — | — |
| DAC Channels | — | YES | YES | — | — | — | — | — | — | — |
| DMA Channels | — | YES | YES | — | — | — | — | — | — | — |
| Format | — | FLOATING POINT | FIXED POINT | — | — | — | — | — | — | — |
| Integrated Cache | — | YES | NO | — | — | — | — | — | — | — |
| Low Power Mode | — | YES | YES | — | — | — | — | — | — | — |
| Number of DMA Channels | — | 14 | 7 | — | — | — | — | — | — | — |
| Number of External Interrupts | — | 43 | 60 | — | — | — | — | — | — | — |
| Number of I/O Lines | — | 111 | 60 | — | — | — | — | — | — | — |
| Number of Serial I/Os | — | 9 | 5 | — | — | — | — | — | — | — |
| Number of Timers | — | 15 | 12 | — | — | — | — | — | — | — |
| On Chip Data RAM Width | — | 8 | 8 | — | — | — | — | — | — | — |
| On Chip Program ROM Width | — | 8 | 8 | — | — | — | — | — | — | — |
| PWM Channels | — | YES | YES | — | — | — | — | — | — | — |
| Peak Reflow Temperature (Cel) | — | NOT SPECIFIED | 260 | NOT SPECIFIED | — | — | 260 | 260 | 260 | — |
| RAM (bytes) | — | 393216 | 36864 | — | — | — | — | — | — | — |
| ROM (words) | — | 262144 | 131072 | — | — | — | — | — | — | — |
| ROM Programmability | — | FLASH | FLASH | — | — | — | — | — | — | — |
| Speed | — | 110 MHz | 64 MHz | — | — | — | — | — | — | — |
| Supply Current-Max | — | 31.38 mA | 7 mA | — | — | — | — | — | — | — |
| Time@Peak Reflow Temperature-Max (s) | — | NOT SPECIFIED | 30 | NOT SPECIFIED | — | — | — | — | — | — |
| JESD-609 Code | — | — | e3 | e3 | — | — | e3 | e1 | e1 | — |
| Terminal Finish | — | — | Matte Tin (Sn) - annealed | Matte Tin (Sn) | — | — | Matte Tin (Sn) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | — |
| Case Connection | — | — | — | ISOLATED | — | — | — | — | — | — |
| Collector Current-Max (IC) | — | — | — | 4 A | — | — | — | — | — | — |
| Collector-Emitter Voltage-Max | — | — | — | 60 V | — | — | — | — | — | — |
| Configuration | — | — | — | DARLINGTON WITH BUILT-IN DIODE AND RESISTOR | — | — | — | — | — | — |
| DC Current Gain-Min (hFE) | — | — | — | 750 | — | — | — | — | — | — |
| JEDEC-95 Code | — | — | — | TO-126 | — | — | — | — | — | — |
| Number of Elements | — | — | — | 1 | — | — | — | — | — | — |
| Polarity/Channel Type | — | — | — | NPN | — | — | — | — | — | — |
| Power Dissipation Ambient-Max | — | — | — | 40 W | — | — | — | — | — | — |
| Power Dissipation-Max (Abs) | — | — | — | 40 W | — | — | — | — | — | — |
| Qualification Status | — | — | — | Not Qualified | — | — | — | — | — | — |
| Transistor Application | — | — | — | SWITCHING | — | — | — | — | — | — |
| Transistor Element Material | — | — | — | SILICON | — | — | — | — | — | — |
| Transition Frequency-Nom (fT) | — | — | — | 10 MHz | — | — | — | — | — | — |
| VCEsat-Max | — | — | — | 2.5 V | — | — | — | — | — | — |
| ## BD677 Alternates Showing results | — | — | — | Image | — | — | — | — | — | — |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Need pricing on these alternatives?
Get one quote covering all 9 alternatives for STM32WB55RGV7TR — response within 24 hours.
Quick Links
Why Look for Alternatives?
Finding alternatives for STM32WB55RGV7TR is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating STM32WB55RGV7TR replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
Can't Find What You Need?
Our sourcing team can help find compatible alternatives for STM32WB55RGV7TR. Get expert recommendations within 24 hours.
FAQ
What is equivalent to STM32WB55RGV7TR?
Known equivalents for STM32WB55RGV7TR include STM32L552ZCT6Q, STM32G071RBT6, BD677. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of STM32WB55RGV7TR?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify STM32WB55RGV7TR alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.