STM32MP135DAE3Alternatives & Equivalent Parts

About STM32MP135DAE3

STM32MP135DAE3 is a Integrated Circuit component manufactured by STMicroelectronics. It comes in a BGA package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Specification Comparison

Parameter	STM32MP135DAE3Source	STM32MP135DAE7	STM32MP133DAE7	STM32MP135FAE7	STM32MP131DAE7	STM32MP135FAE7T	STM32MP133DAE7T
Manufacturer	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Package Type	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Pin Count	289	289	289	289	289	289	289
Temperature Range	—	-40.0°C ~ 105.0°C	-40.0°C ~ 105.0°C	-40.0°C ~ 105.0°C	-40.0°C ~ 105.0°C	-40.0°C ~ 105.0°C	-40.0°C ~ 105.0°C
Price	—	$4.5930	$5.3197	$5.0920	$5.2380	$5.6200	$6.1900
Stock	In Stock	In Stock	In Stock	In Stock	In Stock	In Stock	In Stock
Lifecycle	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE
Electrical Parameters
YTEOL	6	6	9	9	9	9	9
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Address Bus Width	—	26	26	26	26	26	26
Bit Size	—	32	32	32	32	32	32
Boundary Scan	—	YES	YES	YES	YES	YES	YES
Clock Frequency-Max	—	48 MHz	48 MHz	48 MHz	48 MHz	48 MHz	48 MHz
External Data Bus Width	—	16	16	16	16	16	16
Format	—	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Integrated Cache	—	YES	YES	YES	YES	YES	YES
JESD-30 Code	—	S-PBGA-B289	S-PBGA-B289	S-PBGA-B289	S-PBGA-B289	S-PBGA-B289	S-PBGA-B289
Low Power Mode	—	YES	YES	YES	YES	YES	YES
Number of DMA Channels	—	56	56	56	56	56	56
Number of Serial I/Os	—	10	10	10	8	10	10
On Chip Data RAM Width	—	8	8	8	8	8	8
Package Body Material	—	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Equivalence Code	—	BGA289,17X17,32	BGA289,17X17,32	BGA289,17X17,32	BGA289,17X17,32	BGA289,17X17,32	BGA289,17X17,32
Package Shape	—	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package Style	—	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)	—	260	260	—	260	—	—
RAM (words)	—	172032	172032	172032	172032	172032	172032
Speed	—	1000 MHz	1000 MHz	1000 MHz	1000 MHz	1000 MHz	1000 MHz
Supply Current-Max	—	268 mA	268 mA	268 mA	268 mA	268 mA	268 mA
Supply Voltage-Max	—	1.38 V	1.38 V	1.38 V	1.38 V	1.38 V	1.38 V
Supply Voltage-Min	—	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V
Supply Voltage-Nom	—	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V
Surface Mount	—	YES	YES	YES	YES	YES	YES
Technology	—	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal Finish	—	Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)	Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)	—	Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)	—	—
Terminal Form	—	BALL	BALL	BALL	BALL	BALL	BALL
Terminal Pitch	—	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal Position	—	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Factory Lead Time	—	—	13 Weeks	—	13 Weeks	13 Weeks	—

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.