STM32MP133AAF3 STMicroelectronics Integrated Circuit (BGA) In Stock
STM32MP133AAF3 is a 32-bit Arm Cortex-A7 MPU running up to 1 GHz with dual Ethernet, 2x CAN FD, 2x ADC, and 24 timers in a 320-ball BGA package. Priced competitively, available in stock with worldwide shipping.
- Manufacturer
- STMicroelectronics
- Package
- BGA
- Pin Count
- 320
- Lifecycle
- ACTIVE
- Datasheet
- STM32MP133AAF3 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Arm Cortex-A7 core running up to 1 GHz for high-performance Linux or RTOS applications
- Dual Gigabit Ethernet MACs with Time-Sensitive Networking (TSN) support for industrial connectivity
- 2x CAN FD interfaces enabling robust automotive and industrial fieldbus communication
- Integrated 48 MHz clock, 26-bit address bus, and 16-bit external data bus for flexible memory expansion
- 320-ball BGA package with integrated cache for compact, high-density embedded system designs
Applications
The STM32MP133AAF3 is well-suited for industrial control systems, smart gateways, and motor drive platforms requiring real-time networking and audio processing. Its dual Ethernet with TSN support makes it ideal for factory automation, robotics, and edge computing nodes. It also serves automotive-adjacent applications such as telematics units and in-vehicle diagnostic equipment leveraging its CAN FD interfaces.
Specifications
| Factory Lead Time | 13Weeks |
| YTEOL | 9 |
| Address Bus Width | 26 |
| Bit Size | 32 |
| Boundary Scan | YES |
| Clock Frequency-Max | 48MHz |
| External Data Bus Width | 16 |
| Format | FIXED POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B320 |
| Low Power Mode | YES |
| Number of DMA Channels | 56 |
| Number of Serial I/Os | 10 |
| On Chip Data RAM Width | 8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA320,21X21,20 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| RAM (words) | 172032 |
| Speed | 650MHz |
| Supply Current-Max | 239mA |
| Supply Voltage-Max | 1.38V |
| Supply Voltage-Min | 1.21V |
| Supply Voltage-Nom | 1.25V |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Form | BALL |
| Terminal Pitch | 0.5mm |
| Terminal Position | BOTTOM |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | 3A991.A.2 |
| HTS Code | 8542.31.00.25 |
| Country of Origin | Philippines, Taiwan |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for STM32MP133AAF3:
Frequently Asked Questions
What is the maximum CPU frequency of the STM32MP133AAF3, and which processor core does it use?
The STM32MP133AAF3 integrates a single Arm Cortex-A7 core running at up to 1 GHz. This 32-bit architecture supports hardware floating-point and NEON SIMD instructions, making it capable of running full Linux distributions or real-time operating systems with demanding computational workloads in embedded designs.
Which networking interfaces does the STM32MP133AAF3 support, and are they suitable for industrial Ethernet protocols?
The STM32MP133AAF3 features 2x Ethernet MAC controllers with Time-Sensitive Networking (TSN) support, enabling deterministic latency under 1 µs for industrial protocols such as PROFINET and EtherCAT. These dual Gigabit Ethernet ports make it a strong fit for factory automation gateways and industrial IoT edge nodes.
How many CAN FD interfaces does the STM32MP133AAF3 include, and what data rates do they support?
The STM32MP133AAF3 includes 2x CAN FD (Controller Area Network Flexible Data-rate) interfaces. CAN FD supports data phase bit rates up to 8 Mbit/s, enabling high-speed automotive and industrial fieldbus communication well beyond the 1 Mbit/s limit of classic CAN, which is critical for modern vehicle diagnostics and motor control systems.
What package does the STM32MP133AAF3 come in, and what are the pin count and footprint implications?
The STM32MP133AAF3 is housed in a 320-ball BGA (Ball Grid Array) package. This compact package type offers a high I/O density relative to board footprint and includes an integrated cache, making it suitable for space-constrained industrial or embedded designs requiring 26-bit address bus and 16-bit external data bus connectivity.
When would a designer choose the STM32MP133AAF3 over a lower-end STM32 microcontroller for an industrial application?
A designer would choose the STM32MP133AAF3 when the application requires a full Linux OS, dual Ethernet with TSN, 2x CAN FD, and 2x ADC converters operating at up to 1 GHz — capabilities far exceeding any STM32 MCU. For example, a factory gateway needing simultaneous PROFINET and CAN FD fieldbus support at 8 Mbit/s mandates an MPU like this one.
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