STM32H750XBH6Alternatives & Equivalent Parts
About STM32H750XBH6
STM32H750XBH6 is a Integrated Circuit component manufactured by STMicroelectronics. It comes in a BGA package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | STM32H750XBH6Source | LAN8720ACP | STM32H753XIH6 | STM32H755XIH3 | STM32H753XIH6TR |
|---|---|---|---|---|---|
| Manufacturer | STMicroelectronics | Microchip | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package Type | BGA | Quad Flat No-Lead | BGA | BGA | BGA |
| Pin Count | 265 | 25 | 265 | 265 | 265 |
| Temperature Range | -40.0°C ~ 85.0°C | ~ 85.0°C | -40.0°C ~ 85.0°C | -40.0°C ~ 125.0°C | -40.0°C ~ 85.0°C |
| Price | $6.1500 | $3.0000 | $10.9760 | $13.0515 | $11.0887 |
| Stock | In Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE |
| Electrical Parameters | |||||
| Factory Lead Time | 15 Weeks | — | — | 15 Weeks | 15 Weeks |
| Date Of Intro | 2018-07-09 | — | — | — | — |
| YTEOL | 9 | 8 | 9 | 9 | 9 |
| Has ADC | YES | — | YES | YES | YES |
| Bit Size | 32 | — | 32 | 32 | 32 |
| Boundary Scan | YES | — | YES | YES | YES |
| CPU Family | CORTEX-M7 | — | CORTEX-M7 | CORTEX-M4/M7 | — |
| Clock Frequency-Max | 48 MHz | — | 48 MHz | 48 MHz | 48 MHz |
| DAC Channels | YES | — | YES | YES | YES |
| DMA Channels | YES | — | YES | YES | YES |
| Format | FLOATING-POINT | — | — | FLOATING POINT | — |
| Integrated Cache | YES | — | — | YES | — |
| JESD-30 Code | S-PBGA-B265 | S-XQCC-N24 | S-PBGA-B240 | S-PBGA-B265 | S-PBGA-B240 |
| Low Power Mode | YES | — | — | YES | — |
| Number of DMA Channels | 16 | — | — | 4 | — |
| Number of I/O Lines | 168 | — | 168 | 168 | 168 |
| Number of Serial I/Os | 9 | — | — | 11 | — |
| Number of Timers | 20 | — | — | 28 | — |
| On Chip Data RAM Width | 8 | — | — | 8 | — |
| On Chip Program ROM Width | 8 | — | 8 | 8 | 8 |
| PWM Channels | YES | — | YES | YES | YES |
| Package Body Material | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package Equivalence Code | BGA265,17X17,32 | LCC24,.16SQ,20 | — | BGA265,17X17,32 | — |
| Package Shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | — | 260 | 260 | 260 |
| RAM (bytes) | 1085440 | — | 1085440 | 1085440 | 1085440 |
| ROM (words) | 131072 | — | 2097152 | 2097152 | 2097152 |
| ROM Programmability | FLASH | — | FLASH | FLASH | FLASH |
| Speed | 400 MHz | — | 400 MHz | 400 MHz | 400 MHz |
| Supply Current-Max | 400 mA | 54 mA | — | 544 mA | — |
| Supply Voltage-Max | 3.6 V | — | 3.6 V | 3.6 V | 3.6 V |
| Supply Voltage-Min | 3.3 V | — | 3.3 V | 1.62 V | 3.3 V |
| Supply Voltage-Nom | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Surface Mount | YES | YES | YES | YES | YES |
| Technology | CMOS | — | CMOS | CMOS | CMOS |
| Temperature Grade | INDUSTRIAL | COMMERCIAL EXTENDED | INDUSTRIAL | — | INDUSTRIAL |
| Terminal Form | BALL | NO LEAD | BALL | BALL | BALL |
| Terminal Pitch | 0.8 mm | 0.5 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| Terminal Position | BOTTOM | QUAD | BOTTOM | BOTTOM | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | — | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC | — | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
| Reach Compliance Code | — | Compliant | — | — | — |
| Data Rate | — | 100000 Mbps | — | — | — |
| JESD-609 Code | — | e3 | e1 | e1 | e1 |
| Number of Functions | — | 1 | — | — | — |
| Number of Transceivers | — | 1 | — | — | — |
| Qualification Status | — | Not Qualified | — | — | — |
| Screening Level | — | TS 16949 | — | — | — |
| Telecom IC Type | — | ETHERNET TRANSCEIVER | — | — | — |
| Terminal Finish | — | Matte Tin (Sn) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| ## LAN8720ACP Alternates Showing results | — | Image | — | — | — |
| Additional Feature | — | — | TFBGA240+25 - 265 BALL; CONNECTIVITY: HDMI, SPDIFRX(4), SWPMI, MDIO | — | TFBGA240+25 - 265 BALL; CONNECTIVITY: HDMI, SPDIFRX(4), SWPMI, MDIO |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Need pricing on these alternatives?
Get one quote covering all 4 alternatives for STM32H750XBH6 — response within 24 hours.
Quick Links
suggested
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M7 CPU, 400MHz, CMOS, PBGA240
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4/M7 CPU, 400MHz, CMOS, PBGA265
Why Look for Alternatives?
Finding alternatives for STM32H750XBH6 is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating STM32H750XBH6 replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to STM32H750XBH6?
Known equivalents for STM32H750XBH6 include LAN8720ACP, STM32H753XIH6, STM32H755XIH3. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of STM32H750XBH6?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify STM32H750XBH6 alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.