STM32H743VIH6TRAlternatives & Equivalent Parts

About STM32H743VIH6TR

STM32H743VIH6TR is a Integrated Circuit component manufactured by STMicroelectronics. It comes in a BGA package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Specification Comparison

Parameter	STM32H743VIH6TRSource	STM32H742VIH6TR	STM32H743VIH6	STM32H742VIH6	STM32H743VGH6	STM32H742VGH6
Manufacturer	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Package Type	BGA	BGA	BGA	BGA	BGA	BGA
Pin Count	100	100	100	100	100	100
Temperature Range	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C
Price	$7.9406	$8.5875	$8.1417	$8.3633	$7.9066	$7.7069
Stock	In Stock	In Stock	In Stock	In Stock	In Stock	In Stock
Lifecycle	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE
Electrical Parameters
Factory Lead Time	15 Weeks	15 Weeks	15 Weeks	15 Weeks	15 Weeks	15 Weeks
Date Of Intro	2017-09-28	2019-05-03	2017-09-28	2019-05-03	2019-05-03	2019-05-03
YTEOL	9	9	9	9	9	9
Has ADC	YES	YES	YES	YES	YES	YES
Address Bus Width	8	8	8	8	8	8
Bit Size	32	32	32	32	32	32
Boundary Scan	YES	YES	YES	YES	YES	YES
CPU Family	CORTEX-M7	CORTEX-M7	CORTEX-M7	CORTEX-M7	CORTEX-M7	CORTEX-M7
Clock Frequency-Max	48 MHz	48 MHz	48 MHz	48 MHz	48 MHz	48 MHz
DAC Channels	YES	YES	YES	YES	YES	YES
DMA Channels	YES	YES	YES	YES	YES	YES
External Data Bus Width	16	16	16	16	16	16
Format	FLOATING-POINT	FLOATING-POINT	FLOATING-POINT	FLOATING-POINT	FLOATING-POINT	FLOATING-POINT
Integrated Cache	YES	YES	YES	YES	YES	YES
JESD-30 Code	S-PBGA-B100	S-PBGA-B100	S-PBGA-B100	S-PBGA-B100	S-PBGA-B100	S-PBGA-B100
JESD-609 Code	e1	—	—	—	—	—
Low Power Mode	YES	YES	YES	YES	YES	YES
Number of DMA Channels	4	4	4	4	4	4
Number of I/O Lines	82	82	82	82	82	82
Number of Serial I/Os	11	11	11	11	11	11
Number of Timers	21	21	21	21	21	21
On Chip Data RAM Width	8	8	8	8	8	8
On Chip Program ROM Width	8	8	8	8	8	8
PWM Channels	YES	YES	YES	YES	YES	YES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Equivalence Code	BGA100,10X10,32	BGA100,10X10,32	BGA100,10X10,32	BGA100,10X10,32	BGA100,10X10,32	BGA100,10X10,32
Package Shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package Style	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)	260	NOT SPECIFIED	260	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
RAM (bytes)	1085440	708608	1085440	708608	1085440	708608
ROM (words)	2097152	2097152	2097152	2097152	1048576	1048576
ROM Programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Speed	480 MHz	480 MHz	480 MHz	480 MHz	480 MHz	480 MHz
Supply Current-Max	100 mA	100 mA	100 mA	100 mA	100 mA	100 mA
Supply Voltage-Max	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Supply Voltage-Min	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Supply Voltage-Nom	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Surface Mount	YES	YES	YES	YES	YES	YES
Technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)	—	—	—	—	—
Terminal Form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal Pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal Position	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
uPs/uCs/Peripheral ICs Type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Reach Compliance Code	—	Compliant	—	—	—	—
Time@Peak Reflow Temperature-Max (s)	—	NOT SPECIFIED	—	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.