STM32H735IGK3Alternatives & Equivalent Parts

About STM32H735IGK3

STM32H735IGK3 is a Integrated Circuit component manufactured by STMicroelectronics. It comes in a BGA package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Specification Comparison

Parameter	STM32H735IGK3Source	STM32H735IGK6	STM32H725IGK3	STM32H725IGK6	STM32H725IEK6	STM32H725IGK3TR	STM32H730IBK6Q
Manufacturer	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Package Type	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Pin Count	201	201	201	201	201	201	201
Temperature Range	-40.0°C ~ 125.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 125.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 125.0°C	-40.0°C ~ 85.0°C
Price	$7.9300	$7.4100	$8.1154	$7.6748	$7.2394	$8.2781	$6.1340
Stock	In Stock	In Stock	In Stock	In Stock	In Stock	In Stock	In Stock
Lifecycle	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE
Electrical Parameters
Factory Lead Time	15 Weeks	15 Weeks	15 Weeks	15 Weeks	15 Weeks	15 Weeks	15 Weeks
YTEOL	9	9	9	9	9	9	9
Has ADC	YES	YES	YES	YES	YES	YES	YES
Bit Size	32	32	32	32	32	32	32
Boundary Scan	YES	YES	YES	YES	YES	YES	YES
CPU Family	CORTEX-M7	CORTEX-M7	CORTEX-M7	CORTEX-M7	CORTEX-M7	CORTEX-M7	CORTEX-M7
Clock Frequency-Max	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz
DAC Channels	YES	YES	YES	YES	YES	YES	YES
DMA Channels	YES	YES	YES	YES	YES	YES	YES
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated Cache	YES	YES	YES	YES	YES	YES	YES
JESD-30 Code	S-PBGA-B201	S-PBGA-B201	S-PBGA-B201	S-PBGA-B201	S-PBGA-B201	S-PBGA-B201	S-PBGA-B201
JESD-609 Code	e2	e2	e2	e2	e2	e2	e2
Low Power Mode	YES	YES	YES	YES	YES	YES	YES
Number of DMA Channels	4	4	16	16	16	16	4
Number of I/O Lines	128	128	128	128	128	128	128
Number of Serial I/Os	14	14	14	14	14	14	11
Number of Timers	27	27	24	24	24	24	21
On Chip Data RAM Width	8	8	8	8	8	8	8
On Chip Program ROM Width	8	8	8	8	8	8	8
PWM Channels	YES	YES	YES	YES	YES	YES	YES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Equivalence Code	BGA201,15X15,25	BGA201,15X15,25	BGA201,15X15,25	BGA201,15X15,25	BGA201,15X15,25	BGA201,15X15,25	BGA201,15X15,25
Package Shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package Style	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
RAM (bytes)	577536	577536	577536	577536	577536	577536	577536
ROM (words)	1048576	1048576	1048576	1048576	524288	1048576	131072
ROM Programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Speed	550 MHz	550 MHz	550 MHz	550 MHz	550 MHz	550 MHz	550 MHz
Supply Current-Max	360 mA	360 mA	360 mA	360 mA	360 mA	360 mA	200 mA
Supply Voltage-Max	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Supply Voltage-Min	1.62 V	3.3 V	1.62 V	1.8 V	1.8 V	1.62 V	1.8 V
Supply Voltage-Nom	3.3 V	3.3 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Surface Mount	YES	YES	YES	YES	YES	YES	YES
Technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal Finish	Tin/Silver (Sn96.5Ag3.5)	Tin/Silver (Sn96.5Ag3.5)	Tin/Silver (Sn96.5Ag3.5)	Tin/Silver (Sn96.5Ag3.5)	Tin/Silver (Sn96.5Ag3.5)	Tin/Silver (Sn96.5Ag3.5)	Tin/Silver (Sn96.5Ag3.5)
Terminal Form	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal Pitch	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal Position	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
uPs/uCs/Peripheral ICs Type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.