STM32G4A1REY6TRAlternatives & Equivalent Parts

About STM32G4A1REY6TR

STM32G4A1REY6TR is a Integrated Circuit component manufactured by STMicroelectronics. It comes in a BGA package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Specification Comparison

Parameter	STM32G4A1REY6TRSource	STM32G491REY6TR	STM32G431RBI6	STM32G431R8I6	STM32G431R6I6	STM32G431RBI3
Manufacturer	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Package Type	BGA	BGA	BGA	BGA	BGA	BGA
Pin Count	64	64	64	64	64	64
Temperature Range	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 125.0°C
Price	$4.6400	$3.6300	$3.0927	$3.1806	$2.9981	$3.6400
Stock	In Stock	In Stock	In Stock	In Stock	In Stock	In Stock
Lifecycle	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE
Electrical Parameters
Factory Lead Time	12 Weeks	12 Weeks	—	12 Weeks	12 Weeks	12 Weeks
YTEOL	9	9	9	9	9	9
Has ADC	YES	YES	YES	YES	YES	YES
Bit Size	32	32	32	32	32	32
Boundary Scan	YES	YES	YES	YES	YES	YES
CPU Family	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4
Clock Frequency-Max	48 MHz	48 MHz	48 MHz	48 MHz	48 MHz	48 MHz
DAC Channels	YES	YES	YES	YES	YES	YES
DMA Channels	YES	YES	YES	YES	YES	YES
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated Cache	YES	YES	YES	YES	YES	YES
JESD-30 Code	R-PBGA-B64	R-PBGA-B64	S-PBGA-B64	S-PBGA-B64	S-PBGA-B64	S-PBGA-B64
JESD-609 Code	e1	—	—	e2	e2	—
Low Power Mode	YES	YES	YES	YES	YES	YES
Number of DMA Channels	16	16	12	12	12	12
Number of External Interrupts	52	16	16	16	16	16
Number of I/O Lines	52	52	52	52	52	52
Number of Serial I/Os	8	6	6	6	6	6
Number of Timers	16	13	12	12	12	12
On Chip Data RAM Width	8	8	8	8	8	8
On Chip Program ROM Width	8	8	8	8	8	8
PWM Channels	YES	YES	YES	YES	YES	YES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Equivalence Code	BGA64,8X8,16	BGA64,8X8,32	BGA64,8X8,20	BGA64,8X8,20	BGA64,8X8,20	BGA64,8X8,20
Package Shape	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	SQUARE	SQUARE
Package Style	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)	260	—	260	260	260	260
RAM (bytes)	114688	114688	32768	32768	32768	32768
ROM (words)	524288	524288	131072	65536	32768	131072
ROM Programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Speed	170 MHz	170 MHz	170 MHz	170 MHz	170 MHz	170 MHz
Supply Current-Max	33 mA	33 mA	29 mA	29 mA	29 mA	34 mA
Supply Voltage-Max	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Supply Voltage-Min	3 V	1.8 V	3 V	3 V	3 V	1.71 V
Supply Voltage-Nom	3 V	1.8 V	3 V	3 V	3 V	3 V
Surface Mount	YES	YES	YES	YES	YES	YES
Technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)	—	—	Tin/Silver (Sn/Ag)	Tin/Silver (Sn/Ag)	—
Terminal Form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal Pitch	0.4 mm	0.4 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal Position	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
uPs/uCs/Peripheral ICs Type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Time@Peak Reflow Temperature-Max (s)	—	—	NOT SPECIFIED	—	—	30
Date Of Intro	—	—	—	2020-03-31	2020-03-31	2020-03-31

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.