STM32G4A1REI6Alternatives & Equivalent Parts

About STM32G4A1REI6

STM32G4A1REI6 is a Integrated Circuit component manufactured by STMicroelectronics. It comes in a BGA package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Specification Comparison

Parameter	STM32G4A1REI6Source	STM32G431RBI6	STM32G431R8I6	STM32G431R6I6	STM32G431RBI3	STM32G4A1REY6TR	STM32G491REY6TR
Manufacturer	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Package Type	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Pin Count	64	64	64	64	64	64	64
Temperature Range	—	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 125.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C
Price	$4.6500	$3.0927	$3.1806	$2.9981	$3.6400	$4.6400	$3.6300
Stock	In Stock	In Stock	In Stock	In Stock	In Stock	In Stock	In Stock
Lifecycle	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE
Electrical Parameters
Factory Lead Time	12 Weeks	—	12 Weeks	12 Weeks	12 Weeks	12 Weeks	12 Weeks
YTEOL	9	9	9	9	9	9	9
uPs/uCs/Peripheral ICs Type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Has ADC	—	YES	YES	YES	YES	YES	YES
Bit Size	—	32	32	32	32	32	32
Boundary Scan	—	YES	YES	YES	YES	YES	YES
CPU Family	—	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4
Clock Frequency-Max	—	48 MHz	48 MHz	48 MHz	48 MHz	48 MHz	48 MHz
DAC Channels	—	YES	YES	YES	YES	YES	YES
DMA Channels	—	YES	YES	YES	YES	YES	YES
Format	—	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated Cache	—	YES	YES	YES	YES	YES	YES
JESD-30 Code	—	S-PBGA-B64	S-PBGA-B64	S-PBGA-B64	S-PBGA-B64	R-PBGA-B64	R-PBGA-B64
Low Power Mode	—	YES	YES	YES	YES	YES	YES
Number of DMA Channels	—	12	12	12	12	16	16
Number of External Interrupts	—	16	16	16	16	52	16
Number of I/O Lines	—	52	52	52	52	52	52
Number of Serial I/Os	—	6	6	6	6	8	6
Number of Timers	—	12	12	12	12	16	13
On Chip Data RAM Width	—	8	8	8	8	8	8
On Chip Program ROM Width	—	8	8	8	8	8	8
PWM Channels	—	YES	YES	YES	YES	YES	YES
Package Body Material	—	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Equivalence Code	—	BGA64,8X8,20	BGA64,8X8,20	BGA64,8X8,20	BGA64,8X8,20	BGA64,8X8,16	BGA64,8X8,32
Package Shape	—	SQUARE	SQUARE	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR
Package Style	—	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)	—	260	260	260	260	260	—
RAM (bytes)	—	32768	32768	32768	32768	114688	114688
ROM (words)	—	131072	65536	32768	131072	524288	524288
ROM Programmability	—	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Speed	—	170 MHz	170 MHz	170 MHz	170 MHz	170 MHz	170 MHz
Supply Current-Max	—	29 mA	29 mA	29 mA	34 mA	33 mA	33 mA
Supply Voltage-Max	—	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Supply Voltage-Min	—	3 V	3 V	3 V	1.71 V	3 V	1.8 V
Supply Voltage-Nom	—	3 V	3 V	3 V	3 V	3 V	1.8 V
Surface Mount	—	YES	YES	YES	YES	YES	YES
Technology	—	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal Form	—	BALL	BALL	BALL	BALL	BALL	BALL
Terminal Pitch	—	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.4 mm	0.4 mm
Terminal Position	—	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	—	NOT SPECIFIED	—	—	30	—	—
Date Of Intro	—	—	2020-03-31	2020-03-31	2020-03-31	—	—
JESD-609 Code	—	—	e2	e2	—	e1	—
Terminal Finish	—	—	Tin/Silver (Sn/Ag)	Tin/Silver (Sn/Ag)	—	Tin/Silver/Copper (Sn/Ag/Cu)	—

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.