STM32G474VEH3Alternatives & Equivalent Parts
About STM32G474VEH3
STM32G474VEH3 is a Integrated Circuit component manufactured by STMicroelectronics. It comes in a BGA package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | STM32G474VEH3Source | STM32G474VEH6 | STM32G474VBH6 | STM32G484VEH6 | STM32G474VCH6 | STM32G474VCH3TR | STM32G473VCH6 |
|---|---|---|---|---|---|---|---|
| Manufacturer | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package Type | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| Pin Count | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
| Temperature Range | -40.0°C ~ 125.0°C | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C | — | -40.0°C ~ 85.0°C | -40.0°C ~ 125.0°C | — |
| Price | $5.8656 | $5.2906 | $4.4873 | $5.7321 | $4.9418 | $5.4135 | $4.0954 |
| Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE |
| Electrical Parameters | |||||||
| Factory Lead Time | 12 Weeks | 12 Weeks | 12 Weeks | 12 Weeks | 12 Weeks | 12 Weeks | 12 Weeks |
| YTEOL | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| Has ADC | YES | YES | YES | YES | YES | YES | YES |
| Bit Size | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Boundary Scan | YES | YES | YES | — | YES | YES | — |
| CPU Family | CORTEX-M4 | CORTEX-M4 | CORTEX-M4 | — | CORTEX-M4 | CORTEX-M4 | — |
| Clock Frequency-Max | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| DAC Channels | YES | YES | YES | — | YES | YES | — |
| DMA Channels | YES | YES | YES | YES | YES | YES | YES |
| Format | FLOATING POINT | FLOATING POINT | FLOATING POINT | — | FLOATING POINT | FLOATING POINT | — |
| Integrated Cache | YES | YES | YES | — | YES | YES | — |
| JESD-30 Code | S-PBGA-B100 | S-PBGA-B100 | S-PBGA-B100 | — | S-PBGA-B100 | S-PBGA-B100 | — |
| JESD-609 Code | e1 | e1 | e1 | e1 | — | — | e1 |
| Low Power Mode | YES | YES | YES | — | YES | YES | — |
| Number of DMA Channels | 16 | 16 | 16 | — | 16 | 16 | — |
| Number of External Interrupts | 16 | 16 | 16 | — | 16 | 16 | — |
| Number of I/O Lines | 86 | 86 | 86 | 86 | 86 | 86 | 86 |
| Number of Serial I/Os | 9 | 9 | 9 | — | 9 | 6 | — |
| Number of Timers | 15 | 15 | 15 | — | 15 | 15 | — |
| On Chip Data RAM Width | 8 | 8 | 8 | — | 8 | 8 | — |
| On Chip Program ROM Width | 8 | 8 | 8 | — | 8 | 8 | — |
| PWM Channels | YES | YES | YES | YES | YES | YES | YES |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | — | PLASTIC/EPOXY | PLASTIC/EPOXY | — |
| Package Equivalence Code | BGA100,10X10,32 | BGA100,10X10,32 | BGA100,10X10,32 | — | BGA100,10X10,32 | BGA100,10X10,32 | — |
| Package Shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 | 260 | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 |
| RAM (bytes) | 131072 | 131072 | 131072 | — | 131072 | 131072 | — |
| ROM (words) | 524288 | 524288 | 131072 | — | 262144 | 262144 | — |
| ROM Programmability | FLASH | FLASH | FLASH | — | FLASH | FLASH | — |
| Speed | 170 MHz | 170 MHz | 170 MHz | 170 MHz | 170 MHz | 170 MHz | 170 MHz |
| Supply Current-Max | 42 mA | 34 mA | 34 mA | — | 34 mA | — | — |
| Supply Voltage-Max | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Supply Voltage-Min | 1.71 V | 3 V | 3 V | 1.71 V | 3 V | 1.71 V | 1.71 V |
| Supply Voltage-Nom | 3 V | 3 V | 3 V | 3 V | 3 V | 1.8 V | 3 V |
| Surface Mount | YES | YES | YES | YES | YES | YES | YES |
| Technology | CMOS | CMOS | CMOS | — | CMOS | CMOS | — |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | — | — | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| Terminal Pitch | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| Terminal Position | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 | 30 | NOT SPECIFIED | — | NOT SPECIFIED | NOT SPECIFIED | — |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
| Date Of Intro | — | — | 2020-03-31 | 2019-12-16 | 2020-03-31 | — | — |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Need pricing on these alternatives?
Get one quote covering all 6 alternatives for STM32G474VEH3 — response within 24 hours.
Quick Links
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4 CPU, 170MHz, CMOS, PBGA100
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4 CPU, 170MHz, CMOS, PBGA100
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4 CPU, 170MHz, CMOS, PBGA100
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4 CPU, 170MHz, CMOS, PBGA100
Why Look for Alternatives?
Finding alternatives for STM32G474VEH3 is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating STM32G474VEH3 replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to STM32G474VEH3?
Known equivalents for STM32G474VEH3 include STM32G474VEH6, STM32G474VBH6, STM32G484VEH6. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of STM32G474VEH3?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify STM32G474VEH3 alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.