STM32G031J6M3Alternatives & Equivalent Parts
About STM32G031J6M3
STM32G031J6M3 is a Integrated Circuit component manufactured by STMicroelectronics. It comes in a Small Outline Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | STM32G031J6M3Source | TMP116AIDRVR | AT24C02D-XHM-T | 110-87-304-41-001101 | 110-87-306-41-001101 | STM32G051K6U6 |
|---|---|---|---|---|---|---|
| Manufacturer | STMicroelectronics | Texas Instruments | Microchip | Preci-Dip | Preci-Dip | STMicroelectronics |
| Package Type | Small Outline Packages | Small Outline No-lead | Small Outline Packages | Dual-In-Line Sockets | Dual-In-Line Sockets | Quad Flat No-Lead |
| Pin Count | 8 | 7 | 8 | 4 | 6 | 33 |
| Temperature Range | — | -55.0°C ~ 125.0°C | -40.0°C ~ 85.0°C | -55.0°C ~ 125.0°C | -55.0°C ~ 125.0°C | -40.0°C ~ 85.0°C |
| Price | $0.7847 | $1.1933 | $0.1350 | $0.2248 | $0.3352 | $0.9226 |
| Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE |
| Electrical Parameters | ||||||
| Date Of Intro | 2019-07-10 | 2017-06-15 | 2016-12-12 | — | — | — |
| YTEOL | 9 | 15 | 14 | 7 | 7 | 9 |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | — | — | — | — | — |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | — | — | — | — | — |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC | — | — | — | — | MICROCONTROLLER, RISC |
| Pbfree Code | — | Yes | Yes | Yes | Yes | — |
| Accuracy-Max (Cel) | — | 0.2 Cel | — | — | — | — |
| Body Breadth | — | 2 mm | — | — | — | — |
| Body Height | — | 0.8 mm | — | — | — | — |
| Body Length or Diameter | — | 2 mm | — | — | — | — |
| Housing | — | PLASTIC | — | — | — | — |
| JESD-609 Code | — | e4 | — | e3 | e3 | — |
| Mounting Feature | — | SURFACE MOUNT | — | — | — | — |
| Number of Bits | — | 16 | — | — | — | — |
| Operating Current-Max | — | 0.0045 mA | — | — | — | — |
| Output Interface Type | — | 2-WIRE INTERFACE | — | — | — | — |
| Package Body Material | — | PLASTIC/EPOXY | PLASTIC/EPOXY | — | — | UNSPECIFIED |
| Package Shape/Style | — | SQUARE | — | — | — | — |
| Sensors/Transducers Type | — | TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL | — | — | — | — |
| Supply Voltage-Max | — | 5.5 V | — | — | — | 3.6 V |
| Supply Voltage-Min | — | 1.9 V | — | — | — | 3 V |
| Surface Mount | — | YES | YES | — | — | YES |
| Terminal Finish | — | Nickel/Palladium/Gold (Ni/Pd/Au) | — | — | — | — |
| Termination Type | — | SOLDER | — | SOLDER | SOLDER | — |
| Manufacturer Package Code | — | — | TSSOP-8 | — | — | — |
| Factory Lead Time | — | — | 7 Weeks | — | — | 12 Weeks |
| Clock Frequency-Max (fCLK) | — | — | 1 MHz | — | — | — |
| Data Retention Time-Min | — | — | 100 | — | — | — |
| Endurance | — | — | 1000000 Write/Erase Cycles | — | — | — |
| I2C Control Byte | — | — | 1010DDDR | — | — | — |
| JESD-30 Code | — | — | R-PDSO-G8 | — | — | S-XQCC-N32 |
| Memory Density | — | — | 2048 bit | — | — | — |
| Memory IC Type | — | — | EEPROM | — | — | — |
| Memory Width | — | — | 8 | — | — | — |
| Number of Functions | — | — | 1 | — | — | — |
| Number of Words | — | — | 256 words | — | — | — |
| Number of Words Code | — | — | 256 | — | — | — |
| Operating Mode | — | — | SYNCHRONOUS | — | — | — |
| Organization | — | — | 256X8 | — | — | — |
| Output Characteristics | — | — | OPEN-DRAIN | — | — | — |
| Package Equivalence Code | — | — | TSSOP8,.25 | — | — | LCC32,.2SQ,20 |
| Package Shape | — | — | RECTANGULAR | — | — | SQUARE |
| Package Style | — | — | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | — | — | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Parallel/Serial | — | — | SERIAL | — | — | — |
| Programming Voltage | — | — | 3 V | — | — | — |
| Qualification Status | — | — | Not Qualified | — | — | — |
| Serial Bus Type | — | — | I2C | — | — | — |
| Standby Current-Max | — | — | 8e-7 A | — | — | — |
| Supply Current-Max | — | — | 0.001 mA | — | — | 7 mA |
| Supply Voltage-Max (Vsup) | — | — | 3.6 V | — | — | — |
| Supply Voltage-Min (Vsup) | — | — | 2.5 V | — | — | — |
| Supply Voltage-Nom (Vsup) | — | — | 3 V | — | — | — |
| Technology | — | — | CMOS | — | — | CMOS |
| Terminal Form | — | — | GULL WING | — | — | NO LEAD |
| Terminal Pitch | — | — | 0.65 mm | — | — | 0.5 mm |
| Terminal Position | — | — | DUAL | — | — | QUAD |
| Write Cycle Time-Max (tWC) | — | — | 5 ms | — | — | — |
| Write Protection | — | — | HARDWARE | — | — | — |
| ## AT24C02D-XHM-T Alternates Showing results | — | — | Image | — | — | — |
| Additional Feature | — | — | — | STANDARD: UL 94V-0, LOW PROFILE | STANDARD: UL 94V-0, LOW PROFILE | — |
| Body Depth | — | — | — | 0.165 inch | 0.165 inch | — |
| Contact Finish Mating | — | — | — | GOLD FLASH | GOLD FLASH | — |
| Contact Finish Termination | — | — | — | Tin (Sn) | Tin (Sn) | — |
| Contact Material | — | — | — | BERYLLIUM COPPER | BERYLLIUM COPPER | — |
| Contact Style | — | — | — | RND PIN-SKT | RND PIN-SKT | — |
| Current Rating | — | — | — | 1 A | 1 A | — |
| Device Socket Type | — | — | — | IC SOCKET | IC SOCKET | — |
| Device Type Used On | — | — | — | DIP4 | DIP6 | — |
| Dielectric Withstanding Voltage | — | — | — | 1400VAC V | 1400VAC V | — |
| Housing Material | — | — | — | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER | — |
| Insulation Resistance | — | — | — | 10000000000 Ω | 10000000000 Ω | — |
| Mounting Style | — | — | — | STRAIGHT | STRAIGHT | — |
| Number of Contacts | — | — | — | 4 | 6 | — |
| PCB Contact Row Spacing | — | — | — | 0.30000000000000004 mm | 0.30000000000000004 mm | — |
| Has ADC | — | — | — | — | — | YES |
| Bit Size | — | — | — | — | — | 32 |
| Boundary Scan | — | — | — | — | — | NO |
| CPU Family | — | — | — | — | — | Cortex-M0+ |
| Clock Frequency-Max | — | — | — | — | — | 48 MHz |
| DAC Channels | — | — | — | — | — | YES |
| DMA Channels | — | — | — | — | — | YES |
| Format | — | — | — | — | — | FIXED POINT |
| Integrated Cache | — | — | — | — | — | NO |
| Low Power Mode | — | — | — | — | — | YES |
| Number of DMA Channels | — | — | — | — | — | 7 |
| Number of I/O Lines | — | — | — | — | — | 30 |
| Number of Serial I/Os | — | — | — | — | — | 3 |
| Number of Timers | — | — | — | — | — | 15 |
| On Chip Data RAM Width | — | — | — | — | — | 8 |
| On Chip Program ROM Width | — | — | — | — | — | 8 |
| PWM Channels | — | — | — | — | — | YES |
| RAM (bytes) | — | — | — | — | — | 18432 |
| ROM (words) | — | — | — | — | — | 32768 |
| ROM Programmability | — | — | — | — | — | FLASH |
| Speed | — | — | — | — | — | 64 MHz |
| Supply Voltage-Nom | — | — | — | — | — | 3 V |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Need pricing on these alternatives?
Get one quote covering all 5 alternatives for STM32G031J6M3 — response within 24 hours.
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RISC Microcontroller, 32-Bit, FLASH, Cortex-M0+ CPU, 64MHz, CMOS, QCC32
Why Look for Alternatives?
Finding alternatives for STM32G031J6M3 is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating STM32G031J6M3 replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to STM32G031J6M3?
Known equivalents for STM32G031J6M3 include TMP116AIDRVR, AT24C02D-XHM-T, 110-87-304-41-001101. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of STM32G031J6M3?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify STM32G031J6M3 alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.