STM32F423ZHJ6IAlternatives & Equivalent Parts

About STM32F423ZHJ6I

STM32F423ZHJ6I is a Integrated Circuit component manufactured by STMicroelectronics. It comes in a BGA package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Specification Comparison

Parameter	STM32F423ZHJ6ISource	STM32F423ZHJ6	STM32F423ZHJ3	STM32F412ZEJ3	STM32F412ZGJ6TR	STM32F412ZGJ7
Manufacturer	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Package Type	BGA	BGA	BGA	BGA	BGA	BGA
Pin Count	144	144	144	144	144	144
Temperature Range	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 125.0°C	-40.0°C ~ 125.0°C	-40.0°C ~ 85.0°C	-40.0°C ~ 105.0°C
Price	$6.8378	$6.9744	—	$5.4105	$6.4400	$7.0907
Stock	In Stock	In Stock	In Stock	In Stock	In Stock	In Stock
Lifecycle	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE	ACTIVE
Electrical Parameters
Factory Lead Time	15 Weeks	15 Weeks	—	15 Weeks	15 Weeks	15 Weeks
YTEOL	9	9	9	9	9	9
Has ADC	YES	YES	YES	YES	YES	YES
Bit Size	32	32	32	32	32	32
Boundary Scan	YES	YES	YES	YES	YES	YES
CPU Family	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4
Clock Frequency-Max	26 MHz	26 MHz	26 MHz	26 MHz	26 MHz	26 MHz
DAC Channels	YES	YES	YES	NO	NO	NO
DMA Channels	YES	YES	YES	YES	YES	YES
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated Cache	NO	NO	NO	NO	NO	NO
JESD-30 Code	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144
Low Power Mode	YES	YES	YES	YES	YES	YES
Number of DMA Channels	16	16	16	16	16	16
Number of External Interrupts	16	16	16	16	16	16
Number of I/O Lines	114	114	114	114	114	114
Number of Serial I/Os	13	13	13	4	4	4
Number of Timers	15	15	15	15	15	15
On Chip Data RAM Width	8	8	8	8	8	8
On Chip Program ROM Width	8	8	8	8	8	8
PWM Channels	YES	YES	YES	YES	YES	YES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Equivalence Code	BGA144,12X12,32	BGA144,12X12,32	BGA144,12X12,32	BGA144,12X12,32	BGA144,12X12,32	BGA144,12X12,32
Package Shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package Style	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
RAM (bytes)	327680	327680	327680	262144	262144	262144
ROM (words)	1572864	1572864	1572864	524288	1048576	1048576
ROM Programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Speed	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
Supply Current-Max	45.76 mA	45.76 mA	51.71 mA	46.8 mA	42.85 mA	44.28 mA
Supply Voltage-Max	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Supply Voltage-Min	3 V	3 V	1.7 V	1.7 V	1.7 V	1.7 V
Supply Voltage-Nom	3 V	3 V	3 V	3.3 V	3.3 V	3.3 V
Surface Mount	YES	YES	YES	YES	YES	YES
Technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal Form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal Pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal Position	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
uPs/uCs/Peripheral ICs Type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Date Of Intro	—	2017-03-07	2017-03-07	2017-12-19	—	2017-12-19
Peak Reflow Temperature (Cel)	—	260	NOT SPECIFIED	NOT SPECIFIED	260	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	—	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	—	NOT SPECIFIED
RAM (words)	—	—	—	—	65536	—
Temperature Grade	—	—	—	—	INDUSTRIAL	—

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.