STLVDS050BTR STMicroelectronics Integrated Circuit (Small Outline Packages) In Stock
STMicroelectronics STLVDS050BTR is a dual-channel high-speed LVDS line transceiver compliant with EIA/TIA-644, featuring 2 differential drivers, 2 differential receivers, and a 16-pin TSSOP package for point-to-point serial links.
- Manufacturer
- STMicroelectronics
- Package
- Small Outline Packages
- Pin Count
- 16
- Lifecycle
- OBSOLETE
- Datasheet
- STLVDS050BTR Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Dual-channel LVDS transceiver with 2 drivers and 2 receivers per package for full-duplex point-to-point links
- Compliant with EIA-644 and TIA-644 LVDS standards ensuring interoperability with third-party LVDS devices
- High-speed differential signaling enables data rates well above 100 Mbps with low EMI and noise immunity
- 16-pin TSSOP package provides compact SMD footprint for high-density communication interface boards
- Low differential output current of 20 µA maximum input current minimizes loading on LVDS signal lines
Applications
The STLVDS050BTR is used in high-speed point-to-point serial data links within industrial automation, telecommunications backplanes, and embedded computing boards where LVDS reduces EMI compared to single-ended CMOS signals. Its dual-channel architecture supports simultaneous transmit and receive paths for full-duplex communication between FPGAs, DSPs, and line cards. Camera link interfaces, medical imaging front-ends, and test-and-measurement clock distribution networks also deploy this device to achieve noise-immune data transfer over PCB trace distances of 30 cm to several meters.
Specifications
| YTEOL | 0 |
| Differential Output | YES |
| Driver Number of Bits | 2 |
| High Level Input Current-Max | 0.00002A |
| Input Characteristics | DIFFERENTIAL |
| Interface IC Type | LINE TRANSCEIVER |
| Interface Standard | EIA-644; TIA-644 |
| JESD-30 Code | R-PDSO-G16 |
| JESD-609 Code | e0 |
| Number of Functions | 2 |
| Out Swing-Min | 0.247V |
| Output Low Current-Max | 0.002A |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP16,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Qualification Status | Not Qualified |
| Receive Delay-Max | 4ns |
| Receiver Number of Bits | 2 |
| Supply Current-Max | 20mA |
| Supply Voltage-Max | 3.6V |
| Supply Voltage-Min | 3V |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN LEAD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Transmit Delay-Max | 2.7ns |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for STLVDS050BTR:
Frequently Asked Questions
What signaling standard does the STLVDS050BTR implement, and what data rate does LVDS support?
The STLVDS050BTR conforms to EIA-644 and TIA-644 LVDS (Low Voltage Differential Signaling) standards. LVDS transceivers in this class typically support data rates exceeding 400 Mbps per channel, while the differential swing of approximately 350 mV ensures robust noise immunity over PCB traces and short cable runs in industrial and computing environments.
How many independent channels does the STLVDS050BTR provide, and can it operate full-duplex?
The STLVDS050BTR provides 2 differential driver channels and 2 differential receiver channels in a single 16-pin TSSOP package, enabling full-duplex operation on 2 independent serial links simultaneously. This makes it an efficient choice for bidirectional FPGA-to-FPGA or processor-to-peripheral interfaces where sending and receiving data concurrently on separate wire pairs is required.
Why use LVDS over CMOS for high-speed board-level communication in the STLVDS050BTR?
LVDS differential signaling uses a small voltage swing of approximately 350 mV around a 1.2 V common mode, compared to CMOS rail-to-rail swings of 3.3 V or 5 V. This 10x reduction in swing lowers switching noise, reduces electromagnetic interference radiated from PCB traces, and allows clock rates beyond 200 MHz while consuming less dynamic power than equivalent single-ended CMOS drivers.
What is the pin count and package of the STLVDS050BTR, and what PCB pitch does it require?
The STLVDS050BTR is housed in a 16-pin TSSOP package with 0.65 mm pin pitch. This fine-pitch SMD package fits within a PCB footprint of approximately 5 mm x 4.4 mm, which is well-suited for high-density multilayer boards in telecommunications switches, FPGA development platforms, and compact industrial interface modules.
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About STMicroelectronics
STMicroelectronics is a global semiconductor leader serving customers across the spectrum of electronics applications. ST's products are found in a wide range of applications including automotive, industrial, personal electronics, and communications.
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