ST33HTPH2X32AHC5 STMicroelectronics Integrated Circuit (Quad Flat No-Lead) In Stock
STMicroelectronics ST33HTPH2X32AHC5 is a high-temperature TPM 2.0 security device with an I2C interface in a 32-pin QFN package. It operates at 1.8 V nominal supply and supports full Trusted Platform Module 2.0 functionality for secure boot and key storage. Available in stock with worldwide shipping.
- Manufacturer
- STMicroelectronics
- Package
- Quad Flat No-Lead
- Pin Count
- 33
- Lifecycle
- OBSOLETE
- Datasheet
- ST33HTPH2X32AHC5 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 105.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Full TPM 2.0 compliance enabling hardware-rooted secure boot, key generation, and platform attestation
- I2C host interface at 1.8 V nominal supply simplifying integration into low-voltage embedded SoC designs
- High-temperature operation qualified for automotive and industrial environments beyond standard commercial range
- 32-pin Very Thin QFN (LCC32) package with 0.5 mm pitch enabling compact security IC footprint on PCBs
- Long-term supply program (LTE TPM) ensuring availability for multi-year embedded platform lifecycles
Applications
The ST33HTPH2X32AHC5 is designed for automotive ECUs, industrial gateways, and embedded computing modules requiring hardware-rooted security through TPM 2.0 for secure boot, remote attestation, and encrypted key storage. Its 1.8 V I2C interface and high-temperature rating make it suitable for under-hood automotive systems and factory automation controllers operating in elevated-temperature environments. The device also serves networked industrial controllers and IIoT edge nodes where platform integrity measurement and cryptographic key protection are mandatory.
Specifications
| Date Of Intro | 2019-12-09 |
| YTEOL | 0 |
| Additional Feature | ALSO AVAILABLE WITH 3.3V NOM SUPPLY |
| JESD-30 Code | S-XQCC-N32 |
| Package Body Material | UNSPECIFIED |
| Package Equivalence Code | LCC32,.2SQ,20 |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Supply Voltage-Nom | 1.8V |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| uPs/uCs/Peripheral ICs Type | CRYPTOGRAPHIC AUTHENTICATOR |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.31.00.30 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for ST33HTPH2X32AHC5:
Frequently Asked Questions
What supply voltage does ST33HTPH2X32AHC5 require, and can it be used in 3.3 V systems?
The ST33HTPH2X32AHC5 has a nominal supply voltage of 1.8 V for its I2C interface and core operation. STMicroelectronics also offers a 3.3 V variant of this TPM 2.0 device for systems running higher supply rails; if your board operates at 3.3 V, confirm the exact ordering part number to ensure the correct voltage variant is selected before procurement.
Which cryptographic algorithms does the ST33HTPH2X32AHC5 TPM 2.0 device support for key management?
As a TPM 2.0-compliant device, the ST33HTPH2X32AHC5 supports RSA-2048 key generation and storage, ECC P-256 for elliptic-curve operations, SHA-256 for hashing, and AES-128 and AES-256 for symmetric encryption. These algorithms align with the TCG TPM 2.0 specification, making it suitable for FIDO2 authentication, measured boot chains, and platform attestation in automotive ECUs.
How does ST33HTPH2X32AHC5 integrate into an embedded Linux platform's secure boot chain?
The ST33HTPH2X32AHC5 connects to the host processor via I2C and presents a standard TPM 2.0 interface that Linux kernel TPM drivers (tpm_i2c_nuvoton or tpm_tis_i2c) can bind to at boot. Platform firmware measures each boot stage into the TPM's 24 Platform Configuration Registers (PCRs), and a reference policy sealed at manufacturing time allows the OS to verify system integrity before releasing encrypted storage keys, preventing unauthorized firmware modifications.
What PCB footprint does the 32-pin QFN package of ST33HTPH2X32AHC5 require?
The ST33HTPH2X32AHC5 uses a 32-pin Very Thin QFN chip-carrier package with a 5 mm x 5 mm body and 0.5 mm pin pitch, requiring a PCB land pattern of approximately 5.6 mm x 5.6 mm including courtyard clearance. The exposed thermal pad on the bottom improves heat dissipation and should be soldered to a ground-plane copper pour for reliable operation in high-temperature automotive environments up to 105 °C or beyond.
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STMicroelectronics is a global semiconductor leader serving customers across the spectrum of electronics applications. ST's products are found in a wide range of applications including automotive, industrial, personal electronics, and communications.
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