SSM-103-F-DV-BE SAMTEC Connector (Other) In Stock
The SSM-103-F-DV-BE is a dual-row, 6-pin board connector socket from SAMTEC featuring Tiger Claw contacts with gold flash mating finish in a compact 0.3" x 0.288" x 0.2" body. It provides secure, low-insertion-force board-to-board mating with enhanced contact reliability. Available lead-free with worldwide shipping for embedded and industrial applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 6
- Lifecycle
- ACTIVE
- Datasheet
- SSM-103-F-DV-BE Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Tiger Claw contact design delivering superior wiping action and reliable low-resistance mating across thousands of cycles
- Gold flash (3 micro-inch) mating finish ensuring corrosion-free, low-contact-resistance connections in board-to-board applications
- Dual-row (DV) socket layout providing 6 positions in a body as small as 0.3 inch x 0.288 inch
- RoHS-compliant lead-free construction for global market compliance without process changes
- Socket (board connector) style enabling direct mating with SAMTEC SSM-compatible header pins in stacking or daughter-card configurations
Applications
The SSM-103-F-DV-BE is used in board-to-board and daughter-card interconnect designs in embedded systems, small form-factor computing modules, and instrumentation equipment. Its compact 0.3" body and Tiger Claw gold-finish contacts make it suitable for prototype evaluation boards and production modules where reliable low-resistance signal connections must be maintained across repeated mating cycles. The dual-row six-pin configuration is also commonly used in power and signal combined interfaces for FPGA expansion cards, sensor breakout boards, and modular IoT device designs.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 2 Weeks, 5 Days |
| YTEOL | 9.1 |
| Additional Feature | TIGER CLAW CONTACT |
| Body Breadth | 0.2inch |
| Body Depth | 0.288inch |
| Body Length | 0.3inch |
| Body/Shell Style | SOCKET |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD FLASH (3) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | FEMALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insertion Force-Max | 1.21N |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mating Contact Row Spacing | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 6.1mm |
| Plating Thickness | 3u inch |
| Rated Current (Power) | 5.2A |
| Rated Current (Signal) | 5.2A |
| Reference Standard | UL |
| Terminal Pitch | 2.54mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 6 |
| UL Flammability Code | 94V-0 |
| Withdrawl Force-Min | 1.21N |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What are Tiger Claw contacts in the SSM-103-F-DV-BE and how do they improve connection reliability?
Tiger Claw contacts are SAMTEC's proprietary contact geometry that provides an enhanced wiping and grabbing action as the connector mates. This wiping motion displaces surface oxides and contaminants on mating pins to achieve lower and more stable contact resistance, typically below 20 milliohms, even after repeated mating cycles. The design is particularly beneficial in prototype and field-serviceable hardware that undergoes frequent connect-disconnect operations.
What mating finish does the SSM-103-F-DV-BE use and how does it affect contact performance?
The SSM-103-F-DV-BE uses a gold flash mating finish, specified as 3 micro-inches of gold over the contact surface. Gold prevents oxidation and provides a consistent low-resistance interface with contact resistance remaining stable over years of service. This finish is especially important in low-voltage, low-current signal applications where even small increases in contact resistance can affect signal integrity.
How many positions does the SSM-103-F-DV-BE have and what board-to-board pitch does it use?
The SSM-103-F-DV-BE is a dual-row socket with 3 positions per row, giving a total of 6 contacts. It is part of SAMTEC's SSM series, which uses a 0.100-inch (2.54mm) pitch between contacts within each row. The dual-row arrangement on a compact body of 0.3 inches in length makes it an efficient interconnect for six-signal interfaces such as SWD debug headers, SPI buses, or combined power-and-signal connectors.
What is the body size of the SSM-103-F-DV-BE and where is it best positioned on a PCB?
The SSM-103-F-DV-BE has a body measuring 0.3 inches in length, 0.288 inches in depth, and 0.2 inches in breadth. Its compact footprint makes it ideal for placement near the edge of a PCB for easy daughter-card mating or near debugging pads on small embedded modules. The low profile also suits stacking applications where vertical clearance between boards is limited to under 8mm.
Can the SSM-103-F-DV-BE be used as a debug header for SWD or JTAG on a microcontroller board?
Yes, the SSM-103-F-DV-BE's 6-pin dual-row format at 0.100-inch pitch is commonly used as a compact SWD or JTAG debug header. A standard ARM SWD interface requires at minimum 5 signals (SWDCLK, SWDIO, GND, VCC, SWO), and the 6-pin layout of the SSM-103-F-DV-BE accommodates this with one pin to spare. Its gold flash contacts ensure reliable debug connections through the hundreds of probe mating cycles typical in active firmware development.
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