SQW-147-01-S-D-VS-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SQW-147-01-S-D-VS-K-TR is a 94-position, dual-row PCB socket with 2.00 mm pitch and rugged construction. Features vertical surface-mount termination and tape-and-reel packaging. Available in stock worldwide with competitive pricing and fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 94
- Lifecycle
- ACTIVE
- Datasheet
- SQW-147-01-S-D-VS-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 94 positions in a dual-row configuration on a 2.00 mm pitch for high-density board interconnects
- Rugged socket construction with vertical surface-mount termination and gold-plated contacts for reliable signal integrity
- Tape-and-reel (TR) packaging enables automated pick-and-place assembly at high production volumes
Applications
The SQW-147-01-S-D-VS-K-TR is designed for high-density board-to-board and mezzanine connector applications in telecommunications, networking equipment, and industrial control systems. Its 94-position dual-row socket with 2.00 mm pitch is ideal for module-to-backplane mating and test-socket applications where rugged mechanical retention and reliable contact resistance below 20 mΩ are required.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the SQW-147-01-S-D-VS-K-TR provide and what is its contact pitch?
The SQW-147-01-S-D-VS-K-TR is a 94-position, dual-row socket with a 2.00 mm pitch. This combination yields 47 contacts per row, supporting high-density board interconnects in telecom, networking, and industrial PCB designs with reliable contact resistance typically below 20 mΩ.
What termination style and packaging does the SQW-147-01-S-D-VS-K-TR use for PCB assembly?
This connector uses vertical surface-mount (VS) termination for automated SMT reflow assembly and is supplied on tape and reel (TR) for high-volume pick-and-place production. The 2.00 mm pitch spacing allows reliable solder joint formation with standard reflow profiles up to 260 °C.
In which system-level applications is the SQW-147-01-S-D-VS-K-TR a preferred choice over lower-density 2.54 mm pitch sockets?
When board real estate is constrained and 94 signals must cross a mezzanine interface, the 2.00 mm pitch of this SAMTEC socket reduces the connector footprint by roughly 40 % compared to a 2.54 mm pitch alternative. It is preferred in rack-mount networking line cards, FPGA mezzanine modules, and industrial I/O expansion boards where connector height must stay under 8 mm.
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