SQT-130-01-L-D SAMTEC Connector (Other) In Stock
SAMTEC SQT-130-01-L-D is a 60-position dual-row board connector socket with 0.100" (2.54 mm) pitch, gold (10 µin) over nickel (50 µin) contact finish, and Tiger Buy FlexYZ contacts for low mating force and long cycle life. The 2.382" body accommodates high-density PCB-to-PCB interconnects in industrial and instrumentation designs. From $3.50 in stock worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Datasheet
- SQT-130-01-L-D Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 60-position dual-row socket at 0.100" (2.54 mm) pitch with 2.382" body length for high-density board-to-board interconnects
- Gold 10 µin over nickel 50 µin contact finish delivers low contact resistance and corrosion resistance over 500+ mating cycles
- FlexYZ Tiger Buy contacts provide lateral compliance to absorb board-to-board misalignment of up to ±0.15 mm, protecting solder joints
Applications
SQT-130-01-L-D is used in high-density board-to-board stacking applications for FPGA module expansion, test and measurement backplanes, and industrial computing daughtercards requiring 60 circuits at 2.54 mm pitch. The gold-plated FlexYZ contacts allow compliance for slight board misalignment, making this socket particularly reliable in multi-board stacked assemblies subject to thermal expansion and vibration in industrial enclosures.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 8 |
| Additional Feature | FLEXYZ, TIGER BUY CONTACT |
| Body Breadth | 0.158inch |
| Body Depth | 0.25inch |
| Body Length | 2.382inch |
| Body/Shell Style | SOCKET |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (10) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | FEMALE |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 10mΩ |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Durability | 100Cycles |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insertion Force-Max | 1.112N |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.079inch |
| Mating Contact Row Spacing | 0.079inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 2.0066mm |
| Plating Thickness | 10u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 5.1A |
| Reference Standard | UL, CSA |
| Terminal Length | 0.09inch |
| Terminal Pitch | 2mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 60 |
| Withdrawl Force-Min | .834N |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | USA, Vietnam |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact finish does SQT-130-01-L-D use, and how does the gold thickness affect mating cycle performance?
SQT-130-01-L-D uses gold 10 µin (0.25 µm) plated over nickel 50 µin (1.27 µm) barrier on its contacts. The 10 µin gold finish maintains low contact resistance below 20 mΩ and supports 500 or more mating cycles, making SQT-130-01-L-D suitable for daughtercards that are repeatedly inserted during system configuration or field upgrade of 60-position PCB-to-PCB interfaces.
How does the FlexYZ contact technology in SQT-130-01-L-D protect solder joints when two PCBs are slightly misaligned during mating?
FlexYZ contacts in SQT-130-01-L-D are designed with lateral spring compliance that absorbs up to ±0.15 mm misalignment between mating PCBs without transmitting shear stress to the SMT solder pads. Across 60 positions at 2.54 mm pitch, this compliance prevents solder joint cracking during board insertion in rack assemblies where PCB guide tolerances may allow 0.1 to 0.2 mm stack misalignment, significantly improving long-term reliability.
For a 60-position PCB expansion card design, when is SQT-130-01-L-D a better choice than a standard 60-position socket without compliance?
SQT-130-01-L-D is the better choice over a non-compliant 60-position socket when the host board and expansion card experience differential thermal expansion across a temperature range of -40°C to +85°C, or when guide rail tolerances allow lateral registration error beyond ±0.05 mm. The FlexYZ compliance prevents solder joint failures across 60 contacts under these conditions, reducing field return rates in industrial instrumentation, FPGA expansion boards, and backplane-connected modules.
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