SQT-110-01-S-D SAMTEC Connector (Other) In Stock
SQT-110-01-S-D is a SAMTEC 20-position dual-row PCB socket connector with 2.00 mm pitch, gold-plated mating contacts, and tin-nickel termination finish for reliable board-to-board connections. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 20
- Lifecycle
- ACTIVE
- Datasheet
- SQT-110-01-S-D Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 20-position dual-row socket with 2.00 mm pitch for board-to-board interconnects
- Gold contact finish on mating surfaces ensures low-resistance and long-service-life connections
- Tin-with-nickel-barrier termination finish improves solderability and corrosion resistance
- Rugged cost-effective construction suits high-reliability industrial and instrumentation PCB designs
Applications
SQT-110-01-S-D is used in board-to-board stacking applications where a 2.00 mm pitch, 20-position dual-row socket is required for reliable mating with corresponding header connectors. It is well suited for industrial instrumentation, test equipment, and embedded computing modules that demand rugged yet cost-effective PCB socket solutions. Its gold mating contacts and tin-nickel termination make it a reliable choice for connectors exposed to repeated mating cycles in demanding environments.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 3 Weeks, 5 Days |
| YTEOL | 8 |
| Body Breadth | 0.157inch |
| Body Depth | 0.079inch |
| Body Length | 0.799inch |
| Body/Shell Style | SOCKET |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | FEMALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 10mΩ |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insertion Force-Max | 1.112N |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.079inch |
| Mating Contact Row Spacing | 0.079inch |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 2.0066mm |
| Plating Thickness | 30u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 5.1A |
| Reference Standard | UL, CSA |
| Terminal Length | 0.09inch |
| Terminal Pitch | 2mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 20 |
| Withdrawl Force-Min | .834N |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | USA, Vietnam |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does SQT-110-01-S-D have and how are they arranged?
SQT-110-01-S-D has 20 positions arranged in a dual-row configuration with a 2.00 mm pitch between adjacent contacts. This layout provides a compact, high-density interconnect suited for board-to-board stacking designs requiring reliable signal and power routing across 20 circuits.
Which PCB stack-up scenarios is SQT-110-01-S-D best suited for compared to 2.54 mm pitch alternatives?
At 2.00 mm pitch, SQT-110-01-S-D delivers a tighter contact spacing than 2.54 mm alternatives, enabling more connections in less PCB real estate. This makes it preferable for compact embedded computing modules, sensor boards, and industrial controllers where available board space is limited but 20-circuit connectivity is required.
What contact materials does SQT-110-01-S-D use and why does that matter for long-term reliability?
SQT-110-01-S-D uses gold contact finish on the mating surface and tin with a nickel barrier on the termination side. The gold mating surface maintains low contact resistance through repeated mating cycles, while the nickel barrier under the tin termination prevents tin migration and ensures robust solder joint integrity over the connector's service life.
What is the typical factory lead time for SQT-110-01-S-D when ordering in volume?
The factory lead time for SQT-110-01-S-D is typically 3 weeks and 5 days. For time-sensitive production schedules, buyers should check distributor stock availability first, as ordering from stock can eliminate this lead time and support faster assembly throughput for board-to-board connector assemblies using 2.00 mm pitch 20-position sockets.
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